MD56V62160E-10 OKI [OKI electronic componets], MD56V62160E-10 Datasheet - Page 32

• Manufacturer Part Number: MD56V62160E-10
• Manufacturer: OKI [OKI electronic componets]

PACKAGE DIMENSIONS
Notes for Mounting the Surface Mount Type Package
The QFP is a surface mount type package, which is very susceptible to heat in reflow mounting and
humidity absorbed in storage. Therefore, before you perform reflow mounting, contact Oki’s responsible
sales person on the product name, package name, pin number, package code and desired mounting
conditions (reflow method, temperature and times).
OKI Semiconductor
TSOP(2)54-P-400-0.80-K
5
Mirror finish
Package material
Lead frame material
Pin treatment
Package weight (g)
Rev. No./Last Revised
Epoxy resin
42 alloy
Solder plating ( 5µm)
0.55 TYP.
1/Aug. 14, 1997
FEDD56V62160E-01
(Unit: mm)
MD56V62160E
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