SSTUB32866EC/G PHILIPS [NXP Semiconductors], SSTUB32866EC/G Datasheet - Page 2

• Manufacturer Part Number: SSTUB32866EC/G
• Description: 1.8 V 25-bit 1 : 1 or 14-bit 1 : 2 configurable registered buffer with parity for DDR2-800 RDIMM applications
• Manufacturer: PHILIPS [NXP Semiconductors]

NXP Semiconductors
4. Ordering information
Table 1.
SSTUB32866_2
Product data sheet
Type number
SSTUB32866EC/G Pb-free (SnAgCu solder
SSTUB32866EC/S
Ordering information
4.1 Ordering options
Solder process
ball compound)
Pb-free (SnAgCu solder
ball compound)
Table 2.
Type number
SSTUB32866EC/G
SSTUB32866EC/S
Ordering options
Package
Name
LFBGA96 plastic low profile fine-pitch ball grid array package;
LFBGA96 plastic low profile fine-pitch ball grid array package;
Rev. 02 — 9 October 2006
Temperature range
T
T
amb
amb
= 0 C to +70 C
= 0 C to +85 C
1.8 V DDR2-800 configurable registered buffer with parity
Description
96 balls; body 13.5
96 balls; body 13.5
5.5
5.5
1.05 mm
1.05 mm
SSTUB32866
© NXP B.V. 2006. All rights reserved.
Version
SOT536-1
SOT536-1
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