SSTUB32866EC/G PHILIPS [NXP Semiconductors], SSTUB32866EC/G Datasheet - Page 29

• Manufacturer Part Number: SSTUB32866EC/G
• Description: 1.8 V 25-bit 1 : 1 or 14-bit 1 : 2 configurable registered buffer with parity for DDR2-800 RDIMM applications
• Manufacturer: PHILIPS [NXP Semiconductors]

NXP Semiconductors
18. Contents
1
2
3
4
4.1
5
6
6.1
6.2
7
7.1
8
9
10
10.1
11
11.1
11.2
11.3
11.4
12
13
13.1
13.2
13.3
13.4
13.5
14
15
16
16.1
16.2
16.3
16.4
17
18
General description . . . . . . . . . . . . . . . . . . . . . . 1
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Ordering information . . . . . . . . . . . . . . . . . . . . . 2
Functional diagram . . . . . . . . . . . . . . . . . . . . . . 3
Pinning information . . . . . . . . . . . . . . . . . . . . . . 5
Functional description . . . . . . . . . . . . . . . . . . . 8
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . 10
Recommended operating conditions. . . . . . . 11
Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . 12
Test information . . . . . . . . . . . . . . . . . . . . . . . . 17
Package outline . . . . . . . . . . . . . . . . . . . . . . . . 23
Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . 26
Revision history . . . . . . . . . . . . . . . . . . . . . . . . 27
Legal information. . . . . . . . . . . . . . . . . . . . . . . 28
Contact information. . . . . . . . . . . . . . . . . . . . . 28
Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29
Ordering options . . . . . . . . . . . . . . . . . . . . . . . . 2
Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 7
Function table . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Timing diagrams . . . . . . . . . . . . . . . . . . . . . . . 14
Parameter measurement information
for data output load circuit . . . . . . . . . . . . . . . 17
Data output slew rate measurement
information . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
Error output load circuit and voltage
measurement information . . . . . . . . . . . . . . . . 20
Partial parity out load circuit and voltage
measurement information . . . . . . . . . . . . . . . . 21
Introduction to soldering surface mount
packages . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
Reflow soldering . . . . . . . . . . . . . . . . . . . . . . . 24
Wave soldering . . . . . . . . . . . . . . . . . . . . . . . . 24
Manual soldering . . . . . . . . . . . . . . . . . . . . . . 25
Package related soldering information . . . . . . 25
Data sheet status . . . . . . . . . . . . . . . . . . . . . . 28
Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28
Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 28
Trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . . 28
1.8 V DDR2-800 configurable registered buffer with parity
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
© NXP B.V. 2006.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [e-mail]
SSTUB32866
Document identifier: SSTUB32866_2
Date of release: 9 October 2006
All rights reserved.