SSTUB32866EC/G PHILIPS [NXP Semiconductors], SSTUB32866EC/G Datasheet - Page 26

• Manufacturer Part Number: SSTUB32866EC/G
• Description: 1.8 V 25-bit 1 : 1 or 14-bit 1 : 2 configurable registered buffer with parity for DDR2-800 RDIMM applications
• Manufacturer: PHILIPS [NXP Semiconductors]

NXP Semiconductors
14. Abbreviations
SSTUB32866_2
Product data sheet
[4]
[5]
[6]
[7]
[8]
[9]
Table 15.
Acronym
CMOS
DDR
DIMM
LVCMOS
PPO
PRR
RDIMM
SSTL
These packages are not suitable for wave soldering. On versions with the heatsink on the bottom side, the
solder cannot penetrate between the printed-circuit board and the heatsink. On versions with the heatsink
on the top side, the solder might be deposited on the heatsink surface.
If wave soldering is considered, then the package must be placed at a 45 angle to the solder wave
direction. The package footprint must incorporate solder thieves downstream and at the side corners.
Wave soldering is suitable for LQFP, QFP and TQFP packages with a pitch (e) larger than 0.8 mm; it is
definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.
Wave soldering is suitable for SSOP, TSSOP, VSO and VSSOP packages with a pitch (e) equal to or larger
than 0.65 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.
Image sensor packages in principle should not be soldered. They are mounted in sockets or delivered
pre-mounted on flex foil. However, the image sensor package can be mounted by the client on a flex foil by
using a hot bar soldering process. The appropriate soldering profile can be provided on request.
Hot bar soldering or manual soldering is suitable for PMFP packages.
Abbreviations
Description
Complementary Metal Oxide Semiconductor
Double Data Rate
Dual In-line Memory Module
Low Voltage Complementary Metal Oxide Semiconductor
Partial Parity Out
Pulse Repetition Rate
Registered Dual In-line Memory Module
Stub Series Terminated Logic
Rev. 02 — 9 October 2006
1.8 V DDR2-800 configurable registered buffer with parity
SSTUB32866
© NXP B.V. 2006. All rights reserved.
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