ISD17150XYI WINBOND [Winbond], ISD17150XYI Datasheet - Page 16

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ISD17150XYI

Manufacturer Part Number
ISD17150XYI
Description
Multi-Message Single-Chip Voice Record & Playback Devices
Manufacturer
WINBOND [Winbond]
Datasheet
10 TYPICAL APPLICATION CIRCUITS
The following typical applications examples on ISD1700 Series are for references only. They make no
representation or warranty that such applications shall be suitable for the use specified. Each design
has to be optimized in its own system for the best performance on voice quality, current consumption,
functionalities and etc.
The below notes apply to the following applications examples:
Example #1: Recording using microphone input via push-button controls
*
**
*** At 8kHz sampling freq, Rosc = 80 K
These capacitors may be needed in order to optimize for the best voice quality, which is also dependent
upon the layout of the PCB. Depending on system requirements, they can be 10 μF, 4.7 μF or other values.
Please refer to the applications notes or consult Winbond for layout advice.
It is important to have a separate path for each ground and power back to the related terminals to minimize
the noise. Also, the power supplies should be decoupled as close to the device as possible
V
CC
4.7 K Ω
4.7 K
4.7 KΩ
Ω
0.1 F
Rosc ***
0.1 F
4.7 F
μ
μ
μ
4.7 F
μ
24
23
25
26
19
22
10
11
7
6
5
4
20
18
9
REC
PLAY
ERASE
R
AGC
SS
SCLK
MOSI
MISO
AnaIn
FWD
MIC+
MIC -
VOL
FT
OSC
: Digital ground;
ISD1700
- 16 -
AUD/AUX
INT/RDY
RESET
: Analog ground;
V
V
V
SP-
V
V
SP+
V
LED
V
SSP1
SSP2
CCA
SSA
CCP
CCD
SSD
28
21
14
16
12
15
13
17
27
3
2
1
8
1 KΩ
0.1 F
V
0.1 F
CCD
Optional
μ
100 K
V
μ
CCP
: Ground for SP+;
or Buzzer
Speaker
D1
V
Ω
CCD
ISD1700 SERIES
*
0.1 F
0.1 F
vAlert
*
μ
μ
Optional: based upon the applications
AUD
AUX
V
CCA
*
V
V
: Ground for SP-
*
V
**
CCA
CCD
CCP
390 Ω
0.1 F
Vcc
μ
.
Reset
Speaker
0.1 F
V
**
μ
CC
8050C
Gnd

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