ISD17150XYI WINBOND [Winbond], ISD17150XYI Datasheet - Page 20

• Manufacturer Part Number: ISD17150XYI
• Description: Multi-Message Single-Chip Voice Record & Playback Devices
• Manufacturer: WINBOND [Winbond]

Note: Lead coplanarity to be within 0.004 inches.
11.2 28-L
B
C
D
G
H
A
E
F
D
EAD
300-M
0.701
0.097
0.292
0.005
0.014
0.400
0.024
Min
E
28 27 26 25 24 23 22 21 20 19 18 17 16 15
1
Plastic Small Outline Integrated Circuit (SOIC) Dimensions
IL
2 3 4 5
P
LASTIC
INCHES
0.706
0.101
0.296
0.009
0.016
0.050
0.406
0.032
Nom
S
6 7 8 9 10 11 12 13 14
MALL
A
O
F
UTLINE
0.0115
0.711
0.104
0.299
0.019
0.410
0.040
Max
I
NTEGRATED
- 20 -
C
B
IRCUIT
17.81
0.127
10.16
2.46
7.42
0.35
0.61
Min
(SOIC)
ISD1700 SERIES
MILLIMETERS
H
17.93
10.31
Nom
2.56
7.52
0.22
0.41
1.27
0.81
C
G
18.06
10.41
Max
2.64
7.59
0.29
0.48
1.02