ISD17150XYI WINBOND [Winbond], ISD17150XYI Datasheet - Page 18

• Manufacturer Part Number: ISD17150XYI
• Description: Multi-Message Single-Chip Voice Record & Playback Devices
• Manufacturer: WINBOND [Winbond]

10.1
To ensure the highest quality of voice reproduction, it is important to follow good audio design
practices in layout and power supply decoupling. See recommendations from below links or other
Application Notes in our websites.
Design Considerations for ISD1700 Family
Good Audio Design Practices
Single-Chip Board Layout Diagrams
*** At 8kHz sampling freq, Rosc = 80 K
Example #3: Connecting the SPI Interface to a microcontroller
http://www.winbond-usa.com/products/isd_products/chipcorder/applicationinfo/apin11.pdf
http://www.winbond-usa.com/products/isd_products/chipcorder/applicationinfo/apin12.pdf
AN-CC1002 Design Considerations for ISD1700 Family.pdf
G
OOD
A
UDIO
To uC
SPI
D
Rosc ***
ESIGN
0.1 F
μ
4.7 F
μ
P
22
24
23
25
26
19
10
11
7
6
5
4
20
18
RACTICES
9
REC
PLAY
ERASE
AnaIn
R
AGC
FWD
SS
SCLK
MOSI
MISO
MIC -
MIC+
VOL
FT
OSC
: Digital ground;
ISD1700
- 18 -
AUD/AUX
INT/RDY
RESET
: Analog ground;
V
V
SP-
V
V
SP+
V
V
LED
V
SSP1
SSP2
CCA
SSA
CCP
CCD
SSD
28
21
14
16
12
15
13
17
27
3
2
1
8
1 KΩ
0.1 F
V
0.1 F
CCD
Optional
μ
100 K
V
μ
CCP
: Ground for SP+;
or Buzzer
Speaker
D1
V
Ω
CCD
*
0.1 F
0.1 F
ISD1700 SERIES
μ
*
vAlert
μ
Optional: based upon the applications
AUD
AUX
V
CCA
*
V
V
*
: Ground for SP-
**
V
CCA
CCD
CCP
390 Ω
0.1 F
μ
Vcc
Reset
Speaker
0.1 F
V
**
μ
CC
8050C
Gnd