BGD885_01 NXP [NXP Semiconductors], BGD885_01 Datasheet - Page 5

• Manufacturer Part Number: BGD885_01
• Description: 860 MHz, 17 dB gain power doubler amplifier
• Manufacturer: NXP [NXP Semiconductors]

Philips Semiconductors
PACKAGE OUTLINE
2001 Nov 02
Rectangular single-ended package; aluminium flange; 2 vertical mounting holes;
2 x 6-32 UNC and 2 extra horizontal mounting holes; 9 gold-plated in-line leads
860 MHz, 17 dB gain power doubler amplifier
DIMENSIONS (mm are the original dimensions)
UNIT
mm 20.8
VERSION
OUTLINE
SOT115D
max.
A
A 2
U 1
B
max.
L
A 2
9.1
c
0.51
0.38
b
d
0.25 27.2 2.54 13.75 2.54 5.08 12.7 8.8
c
U 2
E
IEC
max.
D
Q
max.
d
P
max.
E
q
JEDEC
e
y
REFERENCES
M
e 1
A
B
F
F
0
S
min.
L
scale
EIAJ
5
5
4.15
3.85
P
W
10 mm
max.
2.4
Q
Z
38.1 25.4
1
q
e 1
2
q 1
3
e
10.2
4
q 2
q 2
q 1
D
5
4.2 44.75
S
6
PROJECTION
EUROPEAN
7
max.
U 1
b
8
y
9
U 2
8
M
B
UNC
6-32
Product specification
W
w
y
0.25
ISSUE DATE
BGD885
w
M
97-04-10
M
B
0.1
SOT115D
y
max.
3.8
Z