M24128-BFBN3G STMICROELECTRONICS [STMicroelectronics], M24128-BFBN3G Datasheet - Page 29

• Manufacturer Part Number: M24128-BFBN3G
• Manufacturer: STMICROELECTRONICS [STMicroelectronics]

M24128, M24C64, M24C32
8
Package mechanical data
In order to meet environmental requirements, ST offers the M24C32, M24C64 and M24128
in ECOPACK
category of second level interconnect is marked on the package and on the inner box label,
in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering
conditions are also marked on the inner box label. ECOPACK is an ST trademark.
ECOPACK specifications are available at www.st.com.
Figure 14. PDIP8 – 8 pin plastic DIP, 0.25 mm lead frame, package outline
1. Drawing is not to scale.
Table 19.
1. Values in inches are converted from mm and rounded to 4 decimal digits.
Symbol
A1
A2
E1
eA
eB
b2
D
A
E
b
c
e
L
PDIP8 – 8 pin plastic DIP, 0.25 mm lead frame, package mechanical data
®
packages. These packages have a lead-free second level interconnect. The
Typ.
3.30
0.46
1.52
0.25
9.27
7.87
6.35
2.54
7.62
3.30
b
b2
8
1
millimeters
D
Min.
0.38
2.92
0.36
1.14
0.20
9.02
7.62
6.10
2.92
–
–
A1
e
A2
E1
A
L
10.16
10.92
Max.
5.33
4.95
0.56
1.78
0.36
8.26
7.11
3.81
–
–
0.1299
0.0181
0.0598
0.0098
0.3650
0.3098
0.2500
0.1000
0.3000
0.1299
Typ.
eA
eB
E
c
Package mechanical data
PDIP-B
inches
0.0150
0.1150
0.0142
0.0449
0.0079
0.3551
0.3000
0.2402
0.1150
Min.
–
–
(1)
0.2098
0.1949
0.0220
0.0701
0.0142
0.4000
0.3252
0.2799
0.4299
0.1500
Max.
–
–
29/39