M24C64-W STMICROELECTRONICS [STMicroelectronics], M24C64-W Datasheet - Page 36

• Manufacturer Part Number: M24C64-W
• Manufacturer: STMICROELECTRONICS [STMicroelectronics]

Package mechanical data
36/42
Figure 19. UFDFPN8 (MLP8) - 8-lead ultra thin fine pitch dual flat no lead, package
1. Drawing is not to scale.
2. The central pad (area E2 by D2 in the above illustration) is internally pulled to V
Table 21.
1. Values in inches are converted from mm and rounded to four decimal digits.
2. Applied for exposed die paddle and terminals. Exclude embedding part of exposed die paddle from
D2 (rev MC)
E2 (rev MC)
K (rev MC)
Symbol
connected to any other voltage or signal line on the PCB, for example during the soldering process.
measuring.
eee
A1
L1
L3
A
D
E
b
e
L
(2)
outline
UFDFPN8 (MLP8) 8-lead ultra thin fine pitch dual flat package no lead
2 x 3 mm, data
0.550
0.020
0.250
2.000
3.000
0.500
Typ
millimeters
Doc ID 16891 Rev 27
0.450
0.000
0.200
1.900
1.200
2.900
1.200
0.300
0.300
0.300
0.080
Min
0.600
0.050
0.300
2.100
1.600
3.100
1.600
0.500
0.150
Max
M24C64-W M24C64-R M24C64-F M24C64-DF
0.0217
0.0008
0.0098
0.0787
0.1181
0.0197
Typ
SS
inches
. It must not be
0.0177
0.0000
0.0079
0.0748
0.0472
0.1142
0.0472
0.0118
0.0118
0.0118
0.0031
Min
(1)
0.0236
0.0020
0.0118
0.0827
0.0630
0.1220
0.0630
0.0197
0.0059
Max