W25Q16 WINBOND [Winbond], W25Q16 Datasheet - Page 57

• Manufacturer Part Number: W25Q16
• Description: 8M-BIT, 16M-BIT AND 32M-BIT SERIAL FLASH MEMORY WITH DUAL AND QUAD SPI
• Manufacturer: WINBOND [Winbond]

12.5 16-Pin SOIC 300-mil (Package Code SF)
Notes:
1. Controlling dimensions: inches, unless otherwise specified.
2. BSC = Basic lead spacing between centers.
3. Dimensions D and E1 do not include mold flash protrusions and should be measured from the bottom of the package.
SYMBOL
E1
D
e
A1
C
A
E
b
L
θ
y
(2)
(3)
(3)
10.08
10.01
2.36
0.10
0.33
0.18
7.39
0.39
MIN
MILLIMETERS
---
0
o
1.27 BSC
- 57 -
10.49
10.64
0.076
MAX
2.64
0.30
0.51
0.28
7.59
1.27
8
o
W25Q80, W25Q16, W25Q32
0.093
0.004
0.013
0.007
0.397
0.394
0.291
0.015
MIN
Publication Release Date: September 26, 2007
---
0
0.050 BSC
o
INCHES
0.104
0.012
0.020
0.011
0.413
0.419
0.299
0.050
0.003
MAX
8
o
Preliminary - Revision B