W25X32 WINBOND [Winbond], W25X32 Datasheet - Page 38

• Manufacturer Part Number: W25X32
• Description: 16M-BIT, 32M-BIT, AND 64M-BIT SERIAL FLASH MEMORY WITH 4KB SECTORS AND DUAL OUTPUT SPI
• Manufacturer: WINBOND [Winbond]

12.8 AC Electrical Characteristics (
Notes:
DESCRIPTION
/HOLD Active Setup Time relative to CLK
/HOLD Active Hold Time relative to CLK
/HOLD Not Active Setup Time relative to CLK
/HOLD Not Active Hold Time relative to CLK
/HOLD to Output Low-Z
/HOLD to Output High-Z
Write Protect Setup Time Before /CS Low
Write Protect Hold Time After /CS High
/CS High to Power-down Mode
/CS High to Standby Mode without Electronic
Signature Read
/CS High to Standby Mode with Electronic
Signature Read
Write Status Register Time
Byte Program Time (First Byte)
Additional Byte Program Time (After First Byte)
Page Program Time
Sector Erase Time (4KB)
Block Erase Time (64KB)
Chip Erase Time W25X16
Chip Erase Time W25X32
Chip Erase Time W25X64
1.
2.
3.
4.
5.
Clock high + Clock low must be less than or equal to 1/f
Value guaranteed by design and/or characterization, not 100% tested in production.
Only applicable as a constraint for a Write Status Register instruction when Sector Protect Bit is set to 1.
Commercial temperature only applies to Fast Read (F
For multiple bytes after first byte within a page,
= number of bytes programmed.
(5)
cont’d)
t
BPN
- 38 -
(5)
=
R0
t
C
BP1 +
W25X16, W25X32, W25X64
& F
.
SYMBOL
t
t
t
t
t
t
HHQX
WHSL
SHWL
HLQZ
RES
RES
R1
t
t
t
t
t
CHHH
HHCH
HLCH
CHHL
DP
t
t
t
). Industrial temperature applies to all other parameters.
t
t
t
t
t
BP2 * N
BP1
BP2
PP
SE
BE
CE
W
1
2
(2)
(2)
(2)
(2)
(2)
(3)
(3)
(typical) and
ALT
t
t
HZ
LZ
t
BPN
MIN
100
20
5
5
5
5
=
t
BP1 +
TYP
SPEC
100
150
1.6
0.8
10
25
40
40
t
6
BP2 * N
(max), where N
MAX
150
300
100
1.8
12
15
12
40
80
7
3
3
3
2
UNIT
ms
ms
ms
ns
ns
ns
ns
ns
ns
ns
ns
µs
µs
µs
µs
µs
s
s
s
s