W25X32 WINBOND [Winbond], W25X32 Datasheet - Page 44

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W25X32

Manufacturer Part Number
W25X32
Description
16M-BIT, 32M-BIT, AND 64M-BIT SERIAL FLASH MEMORY WITH 4KB SECTORS AND DUAL OUTPUT SPI
Manufacturer
WINBOND [Winbond]
Datasheet

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13.5 16-Pin SOIC 300-mil (Winbond Package Code SF)
Notes:
1. Controlling dimensions: inches, unless otherwise specified.
2. BSC = Basic lead spacing between centers.
3. Dimensions D and E1 do not include mold flash protrusions and should be measured from the bottom of the package.
SYMBOL
E1
D
e
A1
C
A
E
b
L
θ
y
(2)
(3)
(3)
10.08
10.01
2.36
0.10
0.33
0.18
7.39
0.39
MIN
MILLIMETERS
---
0
o
1.27 BSC
10.49
10.64
0.076
MAX
0.51
0.28
7.59
1.27
2.64
0.30
8
o
0.093
0.004
0.013
0.007
0.397
0.394
0.291
0.015
MIN
---
0
0.050 BSC
o
INCHES
- 44 -
0.003
0.104
0.012
0.020
0.011
0.413
0.419
0.299
0.050
MAX
8
W25X16, W25X32, W25X64
o

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