EL7554IREZT13 INTERSIL [Intersil Corporation], EL7554IREZT13 Datasheet - Page 7

• Manufacturer Part Number: EL7554IREZT13
• Description: Monolithic 4 Amp DC-DC Step-Down Regulator
• Manufacturer: INTERSIL [Intersil Corporation]

Typical Performance Curves
V
IN
FIGURE 9. HTSSOP THERMAL RESISTANCE vs PCB AREA
= V
D
610
605
600
595
590
585
= 3.3V, V
50
45
40
35
30
25
0
1
(NO AIR FLOW)
0.5
O
2
= 1.8V, I
FIGURE 7. F
1
3
V
IN
=3.3V
V
28-Pin HTSSOP THERMAL PAD
SOLDERED TO 2-LAYER PCB
WITH 0.039" THICKNESS AND
1 OZ. COPPER ON BOTH SIDES
CONDITION:
O
PCB AREA (in
IN
1.5
4
= 4A, L = 2.2µH, C
=5V
FIGURE 11. PACKAGE POWER DISSIPATION vs AMBIENT TEMPERATURE
7
I
O
2
5
S
(A)
vs I
2.5
O
6
2
)
(Continued)
7
4.5
3.5
2.5
1.5
0.5
3
IN
4
3
2
1
0
0
JEDEC JESD51-7 HIGH EFFECTIVE THERMAL
CONDUCTIVITY TEST BOARD HTSSOP EXPOSED
DIEPAD SOLDERED TO PCB PER JESD51-5
= 2x10µF, C
3.5
4.167W
8
25
9
4
AMBIENT TEMPERATURE (°C)
OUT
EL7554
50
= 47µF, C
75
85
OSC
FIGURE 10. PACKAGE POWER DISSIPATION vs AMBIENT
100
= 220pF, T
-0.2
-0.4
1.2
0.8
0.6
0.4
0.2
0.8
0.6
0.4
0.2
0.0
1
0
0
0
125
JEDEC JESD51-3 LOW EFFECTIVE THERMAL
CONDUCTIVITY TEST BOARD HTSSOP EXPOSED
DIEPAD NOT SOLDERED TO PCB
TEMPERATURE
1.136W
FIGURE 8. LOAD REGULATIONS
A
= 25°C unless otherwise noted.
25
150
AMBIENT TEMPERATURE (°C)
1
50
I
O
75
2
(A)
85
100
3
125
January 31, 2005
FN7360.2
150
4