TPS830F TOSHIBA [Toshiba Semiconductor], TPS830F Datasheet - Page 4

• Manufacturer Part Number: TPS830F
• Description: Si Monolithic Photo−IC
• Manufacturer: TOSHIBA [Toshiba Semiconductor]

Circuit Block Diagram
Bit Pattern Designing Example
•
Precautions
1.
2.
3.
4.
5.
6.
Example of code signal = 11010010
To stabilize the power line, insert a bypass capacitor of up to 0.01μF between V
device.
At power−on the internal circuit takes about 100μs to stabilize. During this period the output signal is unstable
and may change.
To avoid unnecessary oscillation, insert a bypass capacitor of 1000pF between V
When using the device, please take the device’s characteristics, the operating environment and the
characteristics of pairing LED device into considerations.
Soldering temperature: ≦ 260°C, soldering time : ≦ 5s (Soldering must be performed under the 2mm from
the body of the device.)
When forming the leads, bend each lead under the 2mm from the body of the device. Soldering must be
performed after the leads have been formed.
Sequence of LED signals = 1 must be avoided. If LED signals of 1
sequence, TPS830(F) may not receive LED signals properly. After an LED
signal of 1, 0 must be sent (55μ or longer interval necessary).
Please take this into account when designing a bit pattern.
The following shows the bit pattern t example that is converted at first
code signals to LED signals as shown on the right diagram.
<Pattern example>
PD
2. GND
LED signals
Code signals
I-V
LPF
26μs
Preamp.
1
62μs
1
0
1
1
(reference)
0 0 0
BPF
0
AGC
1
Average
1
0 0 0 0 0
4
0
Envelope
0
1
1
Slicer
0 0 0
0
Output
CC
3. V CC
1. V O
CC
Code signal
<Conversion example>
and GND, close to the
and GND.
0
1
→
→
TPS830(F)
LED signal
2007-10-01
00
10