LM95172QA2MDA NSC [National Semiconductor], LM95172QA2MDA Datasheet - Page 2

• Manufacturer Part Number: LM95172QA2MDA
• Manufacturer: NSC [National Semiconductor]

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Number
Connection Diagram
Bond Pad Mechanical Dimensions
Origin of coordinates: center of die. Coordinates refer to center of Bond Pad. X-Direction is in the longitudinal axis of the die.
Opening Sizes (Pads 1-4, 6, 8, and 10) = 69.2 µm x 69.2 µm. No Connect = Do not connect to this pad. Manufacturer's test pad.
Pad Descriptions
Pad
1
2
3
4
5
6
7
8
9
OVERTEMP
V
DD ANALOG
Name
V
GND
SC
NC
CS
NC
NC
DD IO
Ground
Output
Power
Power
Type
Input
Input
N/A
N/A
N/A
Pad Number
10
1
2
3
4
5
6
7
8
9
Analog Power Supply
Voltage
I/O Power Supply Voltage
OVERTEMP Alarm
Serial Clock input
No Connect
Chip Select input
No Connect
Power Supply Ground
No Connect
Description
X Coordinate (µm)
Die Bond Pad Layout
No Connect
No Connect
No Connect
−147.35
−497.75
−497.75
497.75
242.80
497.75
0.00
LM95172Q
2
DC Voltage from 3.0V to 5.5V. Bypass with a 10 nF ceramic
capacitor near the pad to ground.
DC Voltage from 3.0V to 5.5V. Bypass with a 10 nF ceramic
capacitor near the pad to ground.
Over-temperature Alarm Output, Open-drain. Active Low on
POR. Requires a pull-up resistor to V
Serial clock from the Controller
Do not connect to this pad.
Chip Select input for the bus. Low pass filtered. (Note 7)
Do not connect to this pad.
Ground
Do not connect to this pad.
Y Coordinate (µm)
30035702
No Connect
No Connect
No Connect
−728.80
−728.80
−728.80
728.80
728.80
728.80
728.80
Typical Connection
DD IO.