STTS424E02BDA3E STMICROELECTRONICS [STMicroelectronics], STTS424E02BDA3E Datasheet - Page 42

• Manufacturer Part Number: STTS424E02BDA3E
• Description: Memory module temperature sensor with a 2 Kb SPD EEPROM
• Manufacturer: STMICROELECTRONICS [STMicroelectronics]

Package mechanical data
10
Figure 15. DFN8 – 8-lead dual flat, no-lead (2 mm x 3 mm) package outline (DA)
1. Drawing is not to scale.
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Package mechanical data
In order to meet environmental requirements, ST offers these devices in ECOPACK
packages. These packages have a halogen-free and lead-free second level interconnect.
The category of second Level Interconnect is marked on the package and on the inner box
label, in compliance with JEDEC Standard JESD97. The maximum ratings related to
soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark.
ECOPACK specifications are available at www.st.com.
DA_ME
STTS424E02
®