STTS424E02BDA3E STMICROELECTRONICS [STMicroelectronics], STTS424E02BDA3E Datasheet - Page 5

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STTS424E02BDA3E

Manufacturer Part Number
STTS424E02BDA3E
Description
Memory module temperature sensor with a 2 Kb SPD EEPROM
Manufacturer
STMICROELECTRONICS [STMicroelectronics]
Datasheet
STTS424E02
List of figures
Figure 1.
Figure 2.
Figure 3.
Figure 4.
Figure 5.
Figure 6.
Figure 7.
Figure 8.
Figure 9.
Figure 10.
Figure 11.
Figure 12.
Figure 13.
Figure 14.
Figure 15.
Figure 16.
Figure 17.
Figure 18.
Figure 19.
Logic diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
DFN8 and TDFN8 connections (top view) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
SMBus/I2C write to pointer register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
SMBus/I
SMBus/I
SMBus/I
Hysteresis . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
Event output boundary timings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
Result of setting the write protection. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30
Setting the write protection (WC = 0) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31
Write mode sequences in a non write-protected area of SPD . . . . . . . . . . . . . . . . . . . . . . 32
Write cycle polling flowchart using ACK . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33
Read mode sequences - SPD . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35
DFN8 – 8-lead dual flat, no-lead (2 mm x 3 mm) package outline (DA) . . . . . . . . . . . . . . . 42
TDFN8 – 8-lead thin dual flat, no-lead (2 mm x 3 mm) package outline (DN) . . . . . . . . . . 44
DA package topside marking information (DFN-8L) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 47
DN package topside marking information (TDFN-8L). . . . . . . . . . . . . . . . . . . . . . . . . . . . . 47
Landing pattern - TDFN package (DN) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 48
2
2
2
C write to pointer register, followed by a read data word. . . . . . . . . . . . . . . . . . . 12
C write to pointer register, followed by a write data word . . . . . . . . . . . . . . . . . . 13
C timing diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
List of figures
5/51

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