LPC1754 NXP [NXP Semiconductors], LPC1754 Datasheet - Page 38

• Manufacturer Part Number: LPC1754
• Description: 32-bit ARM Cortex-M3 MCU; up to 512 kB flash and 64 kB SRAM with Ethernet, USB 2.0 Host/Device/OTG, CAN
• Manufacturer: NXP [NXP Semiconductors]

NXP Semiconductors
9. Thermal characteristics
Table 5.
V
LPC1759_58_56_54_52_51_4
Product data sheet
Symbol
T
DD
j(max)
= 2.4 V to 3.6 V; T
Thermal characteristics
Parameter
maximum junction
temperature
9.1 Thermal characteristics
amb
The average chip junction temperature, T
equation:
The internal power dissipation is the product of I
the I/O pins is often small and many times can be negligible. However it can be significant
in some applications.
T
=
J
•
•
•
−
=
T
R
P
40
amb
D
th(j-a)
T
amb
°
= sum of internal and I/O power dissipation
C to +85
= ambient temperature (°C),
= the package junction-to-ambient thermal resistance (°C/W)
+
(
P
D
°
Conditions
×
C unless otherwise specified;
R
th j a
(
Rev. 04 — 26 January 2010
–
)
)
LPC1759/58/56/54/52/51
J
(°C), can be calculated using the following
Min
-
DD
32-bit ARM Cortex-M3 microcontroller
and V
DD
Typ
-
. The I/O power dissipation of
Max
125
© NXP B.V. 2010. All rights reserved.
Unit
°C
38 of 64
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