M52D16161A-10BG ESMT [Elite Semiconductor Memory Technology Inc.], M52D16161A-10BG Datasheet

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M52D16161A-10BG

Manufacturer Part Number
M52D16161A-10BG
Description
512K x 16Bit x 2Banks Synchronous DRAM
Manufacturer
ESMT [Elite Semiconductor Memory Technology Inc.]
Datasheet
ESMT
SDRAM
FEATURES
PIN CONFIGURATION (TOP VIEW)
Elite Semiconductor Memory Technology Inc.
system clock
1.8V power supply
LVCMOS compatible with multiplexed address
Dual banks operation
MRS cycle with address key programs
-
-
-
EMRS cycle with address key programs.
All inputs are sampled at the positive going edge of the
Burst Read Single-bit Write operation
Special Function Support.
-
-
-
DQM for masking
Auto & self refresh
32ms refresh period (2K cycle)
V
DQ0
DQ1
V
DQ2
DQ3
V
DQ4
DQ5
V
DQ6
DQ7
V
LDQM
WE
CAS
RAS
CS
BA
A10/AP
A0
A1
A2
A3
V
DD
SSQ
DDQ
SSQ
DDQ
DD
CAS Latency (1, 2 & 3 )
Burst Length (1, 2, 4, 8 & full page)
Burst Type (Sequential & Interleave)
PASR (Partial Array Self Refresh )
TCSR (Temperature compensated Self Refresh)
DS (Driver Strength)
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
50
49
48
47
46
45
44
43
42
41
40
39
38
37
36
35
34
33
32
31
30
29
28
27
26
V
DQ15
DQ14
V
DQ13
DQ12
V
DQ11
DQ10
V
DQ9
DQ8
V
N.C/RFU
UDQM
CLK
CKE
N.C
A9
A8
A7
A6
A5
A4
V
SS
SSQ
DDQ
SSQ
DDQ
SS
(0.8 mm PIN PITCH)
(400mil x 825mil)
50PIN TSOP(II)
ORDERING INFORMATION
M52D16161A-10TG 100MHz 50 PIN TSOP(II)
M52D16161A-10BG 100MHz
GENERAL DESCRIPTION
data rate Dynamic RAM organized as 2 x 524,288 words by
16 bits, fabricated with high performance CMOS technology.
Synchronous design allows precise cycle control with the
use of system clock I/O transactions are possible on every
clock cycle. Range of operating frequencies, programmable
burst length and programmable latencies allow the same
device to be useful for a variety of high bandwidth, high
performance memory system applications.
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
The M52D16161A is 16,777,216 bits synchronous high
Part NO.
VSS
DQ14
DQ13
DQ12
DQ10
DQ9
DQ8
CKE
NC
NC
A11
VSS
1
NC
A8
A6
DQ15
VSSQ
VDDQ
UDQM
VSSQ
DQ11
VDDQ
NC
CLK
NC
2
NC
A5
A9
A4
A7
512K x 16Bit x 2Banks
3
Synchronous DRAM
Freq.
MAX
4
Revision : 1.5
Publication Date : Apr. 2007
5
M52D16161A
60 Ball VFBGA
VDDQ
VDDQ
VSSQ
VSSQ
LDQM
DQ0
DQ4
RAS
NC
NC
NC
6
NC
A0
A3
A2
Package
VDD
DQ1
DQ2
DQ3
DQ5
DQ6
DQ7
CAS
VDD
WE
NC
A10
CS
7
NC
A1
(0.65mm ball pitch)
60 Ball VFBGA
(6.4x10.1mm)
Comments
1/29
Pb-free
Pb-free

Related parts for M52D16161A-10BG

M52D16161A-10BG Summary of contents

Page 1

... I/O transactions are possible on every clock cycle. Range of operating frequencies, programmable burst length and programmable latencies allow the same device to be useful for a variety of high bandwidth, high performance memory system applications. ORDERING INFORMATION Part NO. M52D16161A-10TG 100MHz 50 PIN TSOP(II) M52D16161A-10BG 100MHz ...

Page 2

... CAS low. Enables column access. Enables write operation and row precharge. Latches data in starting from CAS , WE active. Makes data output Hi-Z, tSHZ after the clock and masks the output. Blocks data input when L(U)DQM active. M52D16161A LWE LDQM DQi LDQM LWCBR L(U)DQM Input Function Publication Date : Apr ...

Page 3

... OL ≤ 3ns acceptable. ≤ 3ns acceptable all other pins are not under test = 0V. DDQ ≤ OUT DDQ = 1MHz) ° Symbol C CLK ADD C OUT M52D16161A Value -1.0 ~ 4.6 -1.0 ~ 4.6 - 150 0.7 50 ° C ° Typ Max Unit 1.8 1.9 V 1.8 V +0.3 V DDQ 0 0 ...

Page 4

... V (min), CLK V (max Input signals are stable I = 0Ma, Page Burst OL All Band Activated, tCCD = tCCD (min) ≥ (min TCSR range ≤ CKE 0.2V ≤ CKE 0.2V M52D16161A ° CAS Version Latency -10 - 0.12 ∞ = 0.1 =15ns 5.5 ∞ 1.5 ∞ =15ns 10 ∞ ...

Page 5

... RP t (min) 50 RAS t (max) RAS t (min (min) CDL t (min) RDL t (min) BDL t (min) CCD CAS latency=3 CAS latency=2 M52D16161A Unit / 0 DDQ ns V DDQ Vtt =0.5x VDDQ 50 Z0= (Fig.2) AC Output Load Circuit Version Unit - 100 us 90 ...

Page 6

... SAC - SLZ - 7 t SHZ - 8 *All AC parameters are measured from half to half. M52D16161A -15 Unit Note Min Max 15 1000 2 ...

Page 7

... A0-A11 Elite Semiconductor Memory Technology Inc LTMODE WT BL LTMODE RAS WE M52D16161A Address bus Burst Read and Single Write (for Write Through Cache) Mode Register Set A2-A0 000 001 010 Burst length 011 100 101 110 111 0 Wrap type ...

Page 8

... A10 Elite Semiconductor Memory Technology Inc PASR DS M52D16161A Address bus Extended Mode Register Set A2-A0 WT=0 000 2 Banks 001 1 Bank (Bank 0, BA=0) 010 1/2 Bank (BA=A10=0) PASR 011 100 101 1/4 Bank (BA=A10=A9=0) 110 111 A6-A5 Driver Strength 00 Full Strength ...

Page 9

... M52D16161A Interleave Addressing Sequence (decimal Interleave Addressing Sequence (decimal ...

Page 10

... Entry Exit Entry Exit (V= Valid, X= Don’t Care, H= Logic High , L = Logic Low) after the end of burst. RP M52D16161A DQM BA A10/AP A9~A0 Note RAS CAS ...

Page 11

... M52D16161A *Note2,3 *Note4 *Note2 *Note 3 *Note4 ...

Page 12

... Enable auto precharge, precharge bank A at end of burst. 1 Enable auto precharge, precharge bank B at end of burst. 4.A10/AP and BA control bank precharge when precharge command is asserted. A10/AP BA precharge 0 0 Bank Bank Both Banks Elite Semiconductor Memory Technology Inc. Operation M52D16161A Publication Date : Apr. 2007 Revision : 1.5 12/29 ...

Page 13

... Elite Semiconductor Memory Technology Inc M52D16161A ...

Page 14

... Qa1 Qa3 Qa1 Qa3 Qa0 Qa2 Precharge Row Active (A- Bank) (A- Bank) ) after the clock. SHZ +CAS latency-1)+t RCD M52D16161A Cb0 Rb Db0 Db1 Db2 Db3 *Note4 Db0 Db2 Db1 Db3 *Note4 ...

Page 15

... HIGH Cb0 Qa0 Qb0 Qb1 Qa1 Qb2 Qa1 Qb0 Qb1 Qa0 *Note1 Read (A-Bank) before Row precharge, will be written. RDL M52D16161A *Note2 Cc0 Cd0 t RDL Dc0 Dc1 Dd1 Dd0 Dc0 Dc1 Dd0 Dd2 t CDL *Note3 ...

Page 16

... HIGH RBb CBb RBb QAa0 QAa1 QAa2 QAa3 QBb1 QBb2 QBb0 QAa0 QAa1 QAa2 QAa3 QBb0 Read (B-Bank) Row Active (B-Bank) M52D16161A CAc CBd CAe QBb3 QAc0 QAc1 QBd0 QBd1 QBb1 QBb2 QBb3 QAc0 QAc1 QBd0 Read ...

Page 17

... Elite Semiconductor Memory Technology Inc HIGH RBb CBb RBb DBb2 DBb3 DAa1 DAa2 DAa3 DBb0 DBb1 t CDL Write (B-Bank) M52D16161A *Note2 CAc CBd DAc0 DAc1 DBd0 DBd1 t RDL *Note1 Precharge Write (Both Banks) (A-Bank) Write (B-Bank) Publication Date : Apr ...

Page 18

... ESMT Read & Write Cycle at Different Bank @ Burst Length = 4 *Note: 1.t should be met to complete write. CDL Elite Semiconductor Memory Technology Inc. M52D16161A Publication Date : Apr. 2007 Revision : 1.5 18/29 ...

Page 19

... Read with Auto Precharge Start Point ( A - Bank ) ( A - Bank) before internal precharge start RAS M52D16161A ...

Page 20

... Elite Semiconductor Memory Technology Inc M52D16161A ...

Page 21

... *Note2 M52D16161A ...

Page 22

... M52D16161A Publication Date : Apr ...

Page 23

... Row Active ( (B-Bank) Read with Auto Precharge (A-Bank) M52D16161A * ...

Page 24

... Row Active Precharge Active Active Power-Down Power-down Power-down Exit Exit Entry M52D16161A Read Publication Date : Apr. 2007 Revision : 1 ...

Page 25

... *Note3 required before exit from self refresh. RAS M52D16161A Publication Date : Apr ...

Page 26

... CS , RAS , CAS & WE activation at the same clock cycle with address key will set internal mode register. 2.Minimum 2 clock cycles should be met before new RAS activation. 3.Please refer to Mode Register Set table. Elite Semiconductor Memory Technology Inc. Auto Refresh Cycle M52D16161A ...

Page 27

... Elite Semiconductor Memory Technology Inc. Nom Max - 1.20 0.127 0.203 1.00 1.05 - 0.45 0.35 0.40 - 0.21 0.127 0.16 20.95 21.08 11.76 11.96 10.16 10.29 0.50 0.60 0.80 REF 0.80 BSC - 8 M52D16161A Dimension in inch Min Nom - - 0.002 0.005 0.037 0.039 0.012 - 0.012 0.014 0.005 - 0.004 0.005 0.820 0.825 0.455 0.463 0.394 0.400 0.016 0.020 0.031 REF 0.031 BSC 0 - Publication Date : Apr. 2007 Revision : 1 ...

Page 28

... Controlling dimension : Millimeter. Elite Semiconductor Memory Technology Inc. Dimension in mm Min Norm Max Min 1.00 0.20 0.25 0.30 0.008 0.61 0.66 0.71 0.024 0.30 0.35 0.40 0.012 6.30 6.40 6.50 0.248 10.00 10.10 10.20 0.394 3.90 9.10 0.65 M52D16161A Dimension in inch Norm Max 0.039 0.010 0.012 0.026 0.028 0.014 0.016 0.252 0.256 0.398 0.402 0.154 0.358 0.026 Publication Date : Apr. 2007 Revision : 1.5 28/29 ...

Page 29

... If products described here are to be used for such kinds of application, purchaser must do its own quality assurance testing appropriate to such applications. Elite Semiconductor Memory Technology Inc. Important Notice M52D16161A Publication Date : Apr. 2007 Revision : 1.5 29/29 ...

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