UPG132G NEC, UPG132G Datasheet - Page 13

• Manufacturer Part Number: UPG132G
• Description: L-BAND SPDT SWITCH
• Manufacturer: NEC

RECOMMENDED SOLDERING CONDITIONS
than the recommended conditions are to be consulted with our sales representatives.
[ PG132G]
Note It is the storage days after opening a dry pack, the storage conditions are 25 ˚C, less than 65 %, RH.
Caution The combined use of soldering method is to be avoided (However, except the pin area heating
SEMICONDUCTOR DEVICE MOUNTING TECHNOLOGY MANUAL (C10535EJ7V0IF00).
Infrared ray reflow
VPS
Wave Soldering
Pin part heating
This product should be soldered in the following recommended conditions. Other soldering methods and conditions
For details of recommended soldering conditions for surface mounting, refer to information document
Soldering process
method).
Package peak temperature: 230 ˚C
Hour: within 30 s. (more than 210 ˚C)
Time: 2 time, Limited days: no.
Package peak temperature: 215 ˚C
Hour: within 40 s. (more than 200 ˚C),
Time: 2 time, Limited days: no.
Soldering tub temperature: less than 260 ˚C, Hour: within 10 s.
Time: 1 time, Limited days: no.
Pin area temperature: less than 300 ˚C, Hour: within 10 s.
Limited days: no.
Note
Soldering conditions
Note
Note
Note
Recommended condition
symbol
IR30-00-2
VP15-00-2
WS60-00-1
PG132G
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