AM29BDS320G SPANSION [SPANSION], AM29BDS320G Datasheet - Page 73
![no-image](/images/no-image-200.jpg)
AM29BDS320G
Manufacturer Part Number
AM29BDS320G
Description
32 Megabit (2 M x 16-Bit), 1.8 Volt-only Simultaneous Read/Write, Burst Mode Flash Memory
Manufacturer
SPANSION [SPANSION]
Datasheet
1.AM29BDS320G.pdf
(74 pages)
- Current page: 73 of 74
- Download datasheet (2Mb)
Physical Dimensions
VBD064—64-ball Fine-Pitch Ball Grid Array (FBGA)
8 x 9 mm Package
Note: BSC is an ANSI standard for Basic Space Centering.
October 1, 2003 27243B1
PACKAGE
JEDEC
SYMBOL
CORNER
SD / SE
PIN A1
MD
ME
A1
A2
D1
E1
φb
0.05
(2X)
A
D
E
N
e
C
A
0.20
0.62
0.30
MIN
8.95 mm x 7.95 mm NOM
---
INDEX MARK
A1
10
PACKAGE
8.95 BSC.
7.95 BSC.
5.60 BSC.
5.60 BSC.
0.80 BSC.
0.40 BSC.
VBD 064
NONE
NOM
0.35
N/A
---
---
---
64
8
8
TOP VIEW
MAX
1.00
0.30
0.76
0.40
D
SEATING PLANE
SIDE VIEW
OVERALL THICKNESS
BALL HEIGHT
BODY THICKNESS
BODY SIZE
BODY SIZE
BALL FOOTPRINT
BALL FOOTPRINT
ROW MATRIX SIZE D DIRECTION
ROW MATRIX SIZE E DIRECTION
TOTAL BALL COUNT
BALL DIAMETER
BALL PITCH
SOLDER BALL PLACEMENT
DEPOPULATED SOLDER BALLS
P r e l i m i n a r y
NOTE
Am29BDS320G
0.05
A
(2X)
E
B
C
A2
e
C
NOTES:
10 A1 CORNER TO BE IDENTIFIED BY CHAMFER, LASER OR INK
1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M-1994.
2. ALL DIMENSIONS ARE IN MILLIMETERS.
3. BALL POSITION DESIGNATION PER JESD 95-1, SPP-010 (EXCEPT
4.
5. SYMBOL "MD" IS THE BALL ROW MATRIX SIZE IN THE
6
7
8. NOT USED.
9. "+" INDICATES THE THEORETICAL CENTER OF DEPOPULATED
6
AS NOTED).
"D" DIRECTION.
SYMBOL "ME" IS THE BALL COLUMN MATRIX SIZE IN THE
"E" DIRECTION.
N IS THE TOTAL NUMBER OF SOLDER BALLS.
DIMENSION "b" IS MEASURED AT THE MAXIMUM BALL
DIAMETER IN A PLANE PARALLEL TO DATUM C.
SD AND SE ARE MEASURED WITH RESPECT TO DATUMS
A AND B AND DEFINE THE POSITION OF THE CENTER
SOLDER BALL IN THE OUTER ROW.
WHEN THERE IS AN ODD NUMBER OF SOLDER BALLS IN
THE OUTER ROW PARALLEL TO THE D OR E DIMENSION,
RESPECTIVELY, SD OR SE = 0.000.
WHEN THERE IS AN EVEN NUMBER OF SOLDER BALLS IN
THE OUTER ROW, SD OR SE = e/2
BALLS.
MARK, METALLIZED MARK INDENTATION OR OTHER MEANS.
e REPRESENTS THE SOLDER BALL GRID PITCH.
φ 0.08 M
φ 0.15
NXφb
H
M
0.08
0.10
C
C
G
A B
C
C
BOTTOM VIEW
F
E
D1
D C
SD
B A
6
5
3
8
7
4
2
1
SE
A1 CORNER
7
E1
71
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