MCIMX502EVM8B Freescale Semiconductor, Inc, MCIMX502EVM8B Datasheet

MCIMX502EVM8B

Manufacturer Part Number

MCIMX502EVM8B

Description

Manufacturer

Freescale Semiconductor, Inc

Datasheet

1.MCIMX502EVM8B.pdf (134 pages)

Specifications of MCIMX502EVM8B

Date_code

12+

Packing_info

BGA

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Part Number

Manufacturer

Quantity

Price

Company:

BOSTOCK HK LIMITED

Part Number:

MCIMX502EVM8B

Manufacturer:

Freescale Semiconductor

Quantity:

10 000

Current page: 1 of 134
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Freescale reserves the right to change the detail specifications as may be required to permit improvements

in the design of its products.

Freescale Semiconductor

Data Sheet: Technical Data

i.MX50 Applications

Processors for

Consumer Products

The i.MX50 Applications Processors (i.MX50)

represent Freescale Semiconductor’s latest addition to a

growing family of multimedia-focused products,

offering high performance processing optimized for

lowest power consumption.

The i.MX50 is optimized for portable multimedia

applications and it features Freescale’s advanced

implementation of the ARM Cortex-A8™ core, which

operates at speed as high as 800 MHz. The i.MX50

provides a powerful display architecture, including a 2D

Graphics Processing Unit (GPU) and Pixel Processing

Pipeline (ePXP). In addition, i.MX508 includes a

complete integration of the electrophoretic display

function. The i.MX50 supports DDR2, LPDDR2, and

LPDDR1 DRAM at clock rate up to 266 MHz to enable

a range of performance and power trade-offs.

The flexibility of the i.MX50 architecture allows it to be

used in a variety of applications. As the heart of the

application chipset, the i.MX50 provides a rich set of

interfaces for connecting peripherals, such as WLAN,

Bluetooth™, GPS, and displays.

Introduction

2. Architectural Overview . . . . . . . . . . . . . . . . . . . . . . . . . . 10

3. Modules List . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11

4. Electrical Characteristics . . . . . . . . . . . . . . . . . . . . . . . . 20

5. Package Information and Contact Assignments . . . . . 100

6. Revision History . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 133

1.1.

1.2.

1.3.

1.4.

1.5.

2.1.

3.1.

4.1.

4.2.

4.3.

4.4.

4.5.

4.6.

4.7.

4.8.

4.9.

5.1.

5.2.

5.3.

5.4.

Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1

See

Case 416 MAPBGA 13 x 13 mm, 0.5 mm pitch

Case 400 MAPBGA 17 x 17 mm, 0.8 mm pitch

Case 416 PoPBGA 13 x 13 mm, 0.5 mm pitch

Product Overview . . . . . . . . . . . . . . . . . . . . . . . . . . 2

Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3

Ordering Information . . . . . . . . . . . . . . . . . . . . . . . 7

Part Number Feature Comparison . . . . . . . . . . . . . 7

Package Feature Comparison . . . . . . . . . . . . . . . . 8

Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . 10

Special Signal Considerations . . . . . . . . . . . . . . . 17

Chip-Level Conditions . . . . . . . . . . . . . . . . . . . . . 21

Supply Power-Up/Power-Down Requirements and

Restrictions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28

I/O DC Parameters . . . . . . . . . . . . . . . . . . . . . . . . 30

Output Buffer Impedance Characteristics . . . . . . 36

I/O AC Parameters . . . . . . . . . . . . . . . . . . . . . . . . 40

System Modules Timing . . . . . . . . . . . . . . . . . . . . 47

External Interface Module (EIM) . . . . . . . . . . . . . . 59

DRAM Timing Parameters . . . . . . . . . . . . . . . . . . 67

External Peripheral Interfaces . . . . . . . . . . . . . . . 72

13 x 13 mm, 0.5 mm Pitch, 416 Pin MAPBGA Package

Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 100

13 x 13 mm, 0.5 mm Pitch, 416 Pin PoPBGA Package

Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 108

17 x 17 mm, 0.8 mm Pitch, 400 Pin MAPBGA Package

Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 115

Signal Assignments . . . . . . . . . . . . . . . . . . . . . . 123

Table 1 on page 7

Document Number: IMX50CEC

Package Information

Ordering Information

MCIMX50

Plastic Package

for ordering information.

Rev. 2, 05/2012

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