74LV164D,118 NXP Semiconductors, 74LV164D,118 Datasheet - Page 2
![IC 8BIT SHIFT REGISTER 14SOIC](/photos/6/57/65749/14-soic-sot108-1_sml.jpg)
74LV164D,118
Manufacturer Part Number
74LV164D,118
Description
IC 8BIT SHIFT REGISTER 14SOIC
Manufacturer
NXP Semiconductors
Series
74LVr
Datasheet
1.74LV164BQ115.pdf
(21 pages)
Specifications of 74LV164D,118
Package / Case
14-SOIC (3.9mm Width), 14-SOL
Logic Type
Shift Register
Function
Serial to Parallel
Output Type
Standard
Number Of Elements
1
Number Of Bits Per Element
8
Voltage - Supply
1 V ~ 5.5 V
Operating Temperature
-40°C ~ 125°C
Mounting Type
Surface Mount
Counting Sequence
Serial to Parallel
Number Of Circuits
1
Logic Family
LV
Propagation Delay Time
12 ns
Supply Voltage (max)
5.5 V
Maximum Operating Temperature
+ 125 C
Minimum Operating Temperature
- 40 C
Mounting Style
SMD/SMT
Supply Voltage (min)
1 V
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Lead Free Status / RoHS Status
Lead free / RoHS Compliant, Lead free / RoHS Compliant
Other names
74LV164D-T
74LV164D-T
935067450118
74LV164D-T
935067450118
Philips Semiconductors
4. Ordering information
Table 2:
9397 750 14501
Product data sheet
Type number Package
74LV164N
74LV164D
74LV164DB
74LV164PW
74LV164BQ
Ordering information
Temperature range Name
40 C to +125 C
40 C to +125 C
40 C to +125 C
40 C to +125 C
40 C to +125 C
Table 1:
GND = 0 V; T
[1]
[2]
Symbol Parameter
f
C
C
max
I
PD
C
P
f
f
C
V
N = number of inputs switching;
The condition is V
i
o
(C
D
CC
PD
= input frequency in MHz;
L
= output frequency in MHz;
= output load capacitance in pF;
= C
L
is used to determine the dynamic power dissipation (P
= supply voltage in V;
maximum clock
frequency
input capacitance
power dissipation
capacitance per gate
PD
V
Quick reference data
CC
amb
DIP14
SO14
SSOP14
TSSOP14
DHVQFN14
2
V
CC
= 25 C; t
f
o
2
) = sum of the outputs.
I
= GND to V
f
i
Rev. 03 — 4 February 2005
N + (C
r
= t
Description
plastic dual in-line package; 14 leads (300 mil)
plastic small outline package; 14 leads;
body width 3.9 mm
plastic shrink small outline package; 14 leads;
body width 5.3 mm
plastic thin shrink small outline package; 14 leads;
body width 4.4 mm
plastic dual in-line compatible thermal enhanced very
thin quad flat package; no leads; 14 terminals;
body 2.5
f
L
CC
2.5 ns.
.
V
…continued
CC
Conditions
V
V
2
CC
CC
f
= 3.3 V; C
= 3.3 V
3
o
) where:
0.85 mm
L
= 15 pF
8-bit serial-in/parallel-out shift register
D
in W).
[1] [2]
© Koninklijke Philips Electronics N.V. 2005. All rights reserved.
Min
-
-
-
Typ
78
3.5
40
74LV164
Max
-
-
-
Version
SOT27-1
SOT108-1
SOT337-1
SOT402-1
SOT762-1
Unit
MHz
pF
pF
2 of 21