AM29PDLI27H SPANSION [SPANSION], AM29PDLI27H Datasheet - Page 65

• Manufacturer Part Number: AM29PDLI27H
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• Manufacturer: SPANSION [SPANSION]

PHYSICAL DIMENSIONS
VBB080—80-Ball Fine-pitch Ball Grid Array 11.5 x 9 mm package
June 30, 2003
CORNER
PACKAGE
JEDEC
SYMBOL
PIN A1
SD / SE
0.05
(2X)
A
MD
ME
D1
A1
A2
E1
φb
D
N
A
E
e
C
A1
(A3-A6, B3-B6, L3-L6, -M3-M6) DEPOPULATED SOLDER BALLS
INDEX MARK
0.20
0.62
0.30
MIN
11.50 mm x 9.00 mm NOM
---
10
11.50 BSC.
PACKAGE
9.00 BSC.
8.80 BSC.
5.60 BSC.
0.80 BSC.
0.40 BSC.
VBB 080
NOM
0.35
N/A
12
80
---
---
---
8
SIDE VIEW
TOP VIEW
MAX
1.00
0.76
0.40
---
D
A D V A N C E
OVERALL THICKNESS
BALL HEIGHT
BODY THICKNESS
BODY SIZE
BODY SIZE
BALL FOOTPRINT
BALL FOOTPRINT
ROW MATRIX SIZE D DIRECTION
ROW MATRIX SIZE E DIRECTION
TOTAL BALL COUNT
BALL DIAMETER
BALL PITCH
SOLDER BALL PLACEMENT
SEATING PLANE
NOTE
Am29PDL127H
A2
A
0.05
(2X)
I N F O R M A T I O N
C
E
B
C
0.08
0.10 C
e
C
NOTES:
10 A1 CORNER TO BE IDENTIFIED BY CHAMFER, LASER OR INK
1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M-1994.
2. ALL DIMENSIONS ARE IN MILLIMETERS.
3. BALL POSITION DESIGNATION PER JESD 95-1, SPP-010 (EXCEPT
4.
5. SYMBOL "MD" IS THE BALL ROW MATRIX SIZE IN THE
6
7
8. NOT USED.
9. "+" INDICATES THE THEORETICAL CENTER OF DEPOPULATED
AS NOTED).
"D" DIRECTION.
SYMBOL "ME" IS THE BALL COLUMN MATRIX SIZE IN THE
"E" DIRECTION.
N IS THE TOTAL NUMBER OF SOLDER BALLS.
DIMENSION "b" IS MEASURED AT THE MAXIMUM BALL
DIAMETER IN A PLANE PARALLEL TO DATUM C.
SD AND SE ARE MEASURED WITH RESPECT TO DATUMS
A AND B AND DEFINE THE POSITION OF THE CENTER
SOLDER BALL IN THE OUTER ROW.
WHEN THERE IS AN ODD NUMBER OF SOLDER BALLS IN
THE OUTER ROW PARALLEL TO THE D OR E DIMENSION,
RESPECTIVELY, SD OR SE = 0.000.
WHEN THERE IS AN EVEN NUMBER OF SOLDER BALLS IN
THE OUTER ROW, SD OR SE = e/2
BALLS.
MARK, METALLIZED MARK INDENTATION OR OTHER MEANS.
6
e REPRESENTS THE SOLDER BALL GRID PITCH.
e
NXφb
M
φ 0.08 M
φ 0.15
L
K
M
C
C A
J
B
BOTTOM VIEW
H
G
D1
F
SD
E
D
7
C
B
A
8
7
6
5
4
3
2
1
3233 \ 16-038.9h
SE
A1 CORNER
7
E1
63