S72NS-P SPANSION [SPANSION], S72NS-P Datasheet - Page 11

• Manufacturer Part Number: S72NS-P
• Description: MirrorBit Flash Memory and DRAM
• Manufacturer: SPANSION [SPANSION]

6.2
S72NS-P_00_01 September 6, 2006
NSC133—133-ball Fine-Pitch Ball Grid Array (FBGA) 8.0 x 8.0 mm
PACKAGE
SYMBOL
SD / SE
D a t a
JEDEC
D x E
MD
ME
Øb
A1
A2
D1
E1
eE
eD
D
A
E
n
D5-D11,E4-E11,F4-F11,G4-G11 DEPOPULATED SOLDER BALLS
H4-H11,J4-J11,K4-K11,L4-L11
MIN
0.90
0.20
0.70
0.25
S h e e t
8.00 mm x 8.00 mm
PACKAGE
6.50 BSC.
6.50 BSC.
0.50 BSC.
0.25 BSC.
8.00 BSC
8.00 BSC
0.50 BSC
NSC 133
NOM
1.00
0.25
0.76
0.30
N/A
133
14
14
MAX
1.10
0.30
0.82
0.35
( A d v a n c e
PROFILE
BALL HEIGHT
BODY THICKNESS
BODY SIZE
BODY SIZE
MATRIX FOOTPRINT
MATRIX FOOTPRINT
MATRIX SIZE D DIRECTION
MATRIX SIZE E DIRECTION
BALL COUNT
BALL DIAMETER
BALL PITCH
BALL PITCH
SOLDER BALL PLACEMENT
S72NS-P Based MCPs/PoPs
NOTE
I n f o r m a t i o n )
NOTES:
1.
2.
3.
4.
5.
6
7
8.
9
DIMENSIONING AND TOLERANCING METHODS PER
ASME Y14.5M-1994.
ALL DIMENSIONS ARE IN MILLIMETERS.
BALL POSITION DESIGNATION PER JESD 95-1
SPP-010.
SYMBOL "MD" IS THE BALL MATRIX SIZE IN THE "D"
DIRECTION.
SYMBOL "ME" IS THE BALL MATRIX SIZE IN THE
"E" DIRECTION.
n IS THE NUMBER OF POPULTED SOLDER BALL POSITIONS
FOR MATRIX SIZE MD X ME.
DIMENSION "b" IS MEASURED AT THE MAXIMUM BALL
DIAMETER IN A PLANE PARALLEL TO DATUM C.
SD AND SE ARE MEASURED WITH RESPECT TO DATUMS A
AND B AND DEFINE THE POSITION OF THE CENTER SOLDER
BALL IN THE OUTER ROW.
WHEN THERE IS AN ODD NUMBER OF SOLDER BALLS IN THE
OUTER ROW SD OR SE = 0.000.
WHEN THERE IS AN EVEN NUMBER OF SOLDER BALLS IN THE
OUTER ROW, SD OR SE = e/2
"+" INDICATES THE THEORETICAL CENTER OF DEPOPULATED
BALLS.
A1 CORNER TO BE IDENTIFIED BY CHAMFER, LASER OR INK
MARK, METALLIZED MARK INDENTATION OR OTHER MEANS.
e REPRESENTS THE SOLDER BALL GRID PITCH.
3583 \ 16-039.22 \ 8.15.06
9