S72NS-P SPANSION [SPANSION], S72NS-P Datasheet - Page 12

• Manufacturer Part Number: S72NS-P
• Description: MirrorBit Flash Memory and DRAM
• Manufacturer: SPANSION [SPANSION]

6.3
10
ALJ128—128-ball Fine-Pitch Ball Grid Array (FBGA) 12.0 x 12.0 mm
PACKAGE
SYMBOL
SE / SD
JEDEC
D x E
MD
ME
A1
A2
D1
E1
Øb
eE
eD
CORNER
A
D
E
n
N
R
A
PIN A1
0.10
(2X)
A2
C3~C16, D3~D16, E3~E16, F3~F16
L3~L16, M3~M16, N3~N16, P3~P16
G3~G16, H3~H16, J3~J16, K3~K16
128X
0.35
0.60
0.40
MIN
---
C
12.00 mm x 12.00 mm
0.15
0.08
A1
R3~R16, T3~T16
12.00 BSC.
12.00 BSC.
11.05 BSC.
11.05 BSC.
0.325 BSC.
PACKAGE
6
0.65 BSC.
0.65 BSC
ALJ 128
b
NOM
M C A B
M C
0.45
INDEX MARK
N/A
128
128
---
---
---
18
18
2
D a t a
9
SIDE VIEW
TOP VIEW
MAX
1.15
0.72
0.50
---
D
PROFILE
BALL HEIGHT
BODY THICKNESS
BODY SIZE
BODY SIZE
MATRIX FOOTPRINT
MATRIX FOOTPRINT
MATRIX SIZE D DIRECTION
MATRIX SIZE E DIRECTION
BALL COUNT
MAXIMUM NUMBER OF BALLS
NUMBER OF LAND PERIMETERS
BALL DIAMETER
BALL PITCH
BALL PITCH
SOLDER BALL PLACEMENT
DEPOPULATED SOLDER BALLS
S72NS-P Based MCPs/PoPs
S h e e t
NOTE
C
A
0.10
(2X)
( A d v a n c e
E
B
C
0.10
0.10
eE
eD
C
C
NOTES:
1.
2.
3.
4.
5.
6
7
8.
9
10 OUTLINE AND DIMENSIONS PER CUSTOMER REQUIREMENT.
DIMENSIONING AND TOLERANCING METHODS PER
ASME Y14.5M-1994.
ALL DIMENSIONS ARE IN MILLIMETERS.
BALL POSITION DESIGNATION PER JEP95, SECTION
3.0, SPP-010.
SYMBOL "MD" IS THE BALL MATRIX SIZE IN THE "D"
DIRECTION.
SYMBOL "ME" IS THE BALL MATRIX SIZE IN THE
"E" DIRECTION.
n IS THE NUMBER OF POPULTED SOLDER BALL POSITIONS
FOR MATRIX SIZE MD X ME.
N IS THE MAXIMUM NUMBER OF BALLS ON THE FBGA PACKAGE.
DIMENSION "b" IS MEASURED AT THE MAXIMUM BALL
DIAMETER IN A PLANE PARALLEL TO DATUM C.
DATUM C IS THE SEATING PLANE AND IS DEFINED BY THE
CROWNS OF THE SOLDER BALLS.
SD AND SE ARE MEASURED WITH RESPECT TO DATUMS A
AND B AND DEFINE THE POSITION OF THE CENTER SOLDER
BALL IN THE OUTER ROW.
WHEN THERE IS AN ODD NUMBER OF SOLDER BALLS IN THE
OUTER ROW SD OR SE = 0.000.
WHEN THERE IS AN EVEN NUMBER OF SOLDER BALLS IN THE
OUTER ROW, SD OR SE = e/2
"+" INDICATES THE THEORETICAL CENTER OF DEPOPULATED
BALLS.
A1 CORNER TO BE IDENTIFIED BY CHAMFER, LASER OR INK
MARK, METALLIZED MARK INDENTATION OR OTHER MEANS.
e REPRESENTS THE SOLDER BALL GRID PITCH.
I n f o r m a t i o n )
18 17
16
15
14
BOTTOM VIEW
13 12
S72NS-P_00_01 September 6, 2006
11
10
D1
9
8
SD
7
6
5
4
7
3
2
1
T
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
U
V
SE
CORNER
3561 16 038 24 \ 5 15 6
PIN A1
7
E1