PPC440EP-3PBFFFCX AMCC [Applied Micro Circuits Corporation], PPC440EP-3PBFFFCX Datasheet - Page 62

• Manufacturer Part Number: PPC440EP-3PBFFFCX
• Description: Power PC 440EP Embedded Processor
• Manufacturer: AMCC [Applied Micro Circuits Corporation]

Table 12. DC Power Supply Current Loads
Table 13. Package Thermal Specifications
Thermal resistance values for the E-PBGA and TE-PBGA package are as follows:
Thermal Management
The following heat sinks were used in the above thermal analysis:
ALPHA W35-15W (35mm x 35mm x15mm)
ALPHA LPD35-15B (35mm x 35mm x15mm)
62
Revision 1.26 – April 25, 2007
V
OV
SV
AV
SAV
Notes:
1. See “Absolute Maximum Ratings” on page 59 for filter recommendations.
2. The maximum current values listed above are not guaranteed to be the highest obtainable. These values are dependent on many factors
3. Typical current is estimated at 667MHz with V
4. Maximum current is estimated at 667MHz with V
Junction-to-ambient thermal resistance
without heat sink
Junction-to-ambient thermal resistance
with heat sink
Junction-to-case thermal resistance
Junction-to-board thermal resistance
Notes:
DD
drives worst-case power), while running Linux and a test application that exercises each core with representative traffic.
1. Case temperature, T
2. T
3. T
4. The preceding equations assume that the chip is mounted on a board with at least one signal and two power planes.
5. Values in the table were achieved with a JEDEC standard board: 114.5mm x 101.6mm x 1.6mm, 4 layers.
6. Values for an attached heat sink were achieved with a 35mm x 35mm x 15mm unit (see Thermal Management below), attached with a
application that exercises each core with representative traffic.
DD
DD
including the type of applications running, clock rates, use of internal functional capabilities, external interface usage, case temperature,
and the power supply voltages. Your specific application can produce significantly different results. V
dependent on the applications running and the use of internal chip functions (DMA, PCI, Ethernet, and so on). OV
are primarily dependent on the capacitive loading, frequency, and utilization of the external buses.
DD
DD
(1.5V) active operating current
0.1mm thickness of adhesive having a thermal conductivity of 1.3W/mK.
(2.5V) active operating current
(1.5V) input current
(3.3V) active operating current
A
CMax
(1.5V) active operating current
= T
Data Sheet
=
C
- P
T
JMax
Parameter
×θ
CA
- P
, where T
×θ
Parameter
JC
C
, is measured at top center of case surface with device soldered to circuit board.
, where T
A
is ambient temperature and P is power consumption.
JMax
is maximum junction temperature (+125°C) and P is power consumption.
Symbol
DD
θ
θ
θ
θ
JA
JA
JC
JB
DD
= +1.5V, OV
= +1.6V, OV
Package
E-PBGA
E-PBGA
E-PBGA
E-PBGA
DD
DD
Symbol
= +3.3V, SV
I
I
I
I
SADD
I
ODD
SDD
ADD
= +3.6V, SV
DD
440EP – PPC440EP Embedded Processor
0 (0)
20.0
15.3
DD
DD
= +2.5V, and T
Typical
Resistance Value
= +2.7V, T
1380
6.05
460
ft/min (m/sec)
3.2
10
100 (0.51)
Airflow
18.7
11.9
14.3
8.3
C
C
= +85°C, and a best-case process (which
= +85°C, while running Linux and a test
Maximum
DD
2200
200 (1.02)
100
600
10
current and power are primarily
5
17.9
10.5
DD
current and power
Unit
mA
mA
mA
mA
mA
°C/W
°C/W
°C/W
°C/W
Unit
AMCC Proprietary
Notes
Notes
1
1