PPC440GX-3FF533C AMCC [Applied Micro Circuits Corporation], PPC440GX-3FF533C Datasheet - Page 59

• Manufacturer Part Number: PPC440GX-3FF533C
• Description: Power PC 440GX Embedded Processor
• Manufacturer: AMCC [Applied Micro Circuits Corporation]

Revision 1.15 – August 30, 2007
Package Thermal Specifications
Thermal resistance values for the CBGA and PBGA packages in a convection environment are as follows:
AMCC
Junction-to-case thermal resistance
Case-to-ambient thermal resistance (w/o heat
sink)
Junction-to-ball (typical)
Notes:
Data Sheet
1. Case temperature, T
2. The case-to-ambient thermal resistance is measured in a JEDEC JESD51-6 standard environment; and may not accurately predict
3. Modeled on standard JEDEC 2S2P card, 50x50mm
4. 1.5 °C/W is the theoretical
thermal performance in production equipment environments. The operational case temperature must be maintained.
using 1oz. copper power planes, with an effective heat transfer area of 75mm
Parameter
C
, is measured at top center of case surface with device soldered to circuit board.
θ
JB
using an infinite heat sink. The larger number applies to the module mounted on a 1.8mm thick, 2P card
Symbol
θ
θ
θ
CA
JC
JB
440GX – Power PC 440GX Embedded Processor
Ceramic
Plastic
Ceramic
Plastic
Ceramic
Plastic
Package
0 (0)
<0.1
18.9
2
Min
1.2
1.5
.
ft/min (m/sec)
100 (0.51)
Airflow
Range
Nom
<0.1
17.7
20.8
1.2
8.2
200 (1.02)
<0.1
16.3
Max
1.2
2.2
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
Unit
Notes
1, 3
2, 3
1
2
4
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