PPC440GX-3FF533C AMCC [Applied Micro Circuits Corporation], PPC440GX-3FF533C Datasheet - Page 62

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PPC440GX-3FF533C

Manufacturer Part Number
PPC440GX-3FF533C
Description
Power PC 440GX Embedded Processor
Manufacturer
AMCC [Applied Micro Circuits Corporation]
Datasheet
440GX – Power PC 440GX Embedded Processor
62
Recommended DC Operating Conditions
Device operation beyond the conditions specified is not recommended. Extended operation beyond the recommended
conditions can affect device reliability.
Input Capacitance
Output Max Allowable Overshoot (3.3V LVTTL)
Output Max Allowable Undershoot (3.3V LVTTL)
Case Temperature rating for C package and S package
Case Temperature rating E for C package
Case Temperature rating E for F package
Notes:
Group 1 (2.5V SSTL I/O)
Group 2 (3.3V LVTTL I/O)
Group 3 (PCI-X I/O)
Group 4 (Receivers)
Group 5 (3.3V tolerant CMOS I/O)
1. PCI-X drivers meet PCI-X specifications.
2. SV
3. The analog voltages used for the on-chip PLLs can be derived from the logic voltage, but must be filtered before entering the
4. During chip power-up, OV
5. LPDL is least positive down level; MPUL is most positive up level.
6. Case temperature, T
PPC440GX. See “Absolute Maximum Ratings” on page 58.
OV
up cycle is started.
REF
DD
is applied to the chip. A power-down cycle should complete (OV
= SV
DD
/2
Parameter
C
Parameter
, is measured at top center of case surface with device soldered to circuit board.
DD
should begin to ramp before V
Symbol
V
V
OMAU3
OMAO
DD
T
T
T
(Continued)
C
C
C
. External voltage should not be applied to the chip I/O pins before
Symbol
C
C
C
C
C
IN1
IN2
IN3
IN4
IN5
Minimum
DD
-0.6
-40
-40
-40
and V
DD
Maximum
should both be below 0.4V) before a new power-
12
12
12
16
9
Typical
Revision 1.15 – August 30, 2007
Maximum
+105
+100
+3.9
Unit
+85
pF
pF
pF
pF
pF
Data Sheet
Unit
°C
°C
°C
V
V
Notes
Notes
AMCC
6
6
6

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