HCTS02HMSR INTERSIL [Intersil Corporation], HCTS02HMSR Datasheet
HCTS02HMSR
Related parts for HCTS02HMSR
HCTS02HMSR Summary of contents
Page 1
... HCTS02KMSR - +125 C Intersil Class S Equivalent o HCTS02D/ +25 C Sample Sample o HCTS02K/ +25 C Sample Sample o HCTS02HMSR +25 C Die CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures. | http://www.intersil.com or 407-727-9207 Copyright HCTS02MS Pinouts 2 /mg -9 Errors/Bit-Day 12 Rads (Si)/ +125 C Y1 ...
Page 2
Absolute Maximum Ratings Supply Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.5V to +7.0V Input Voltage ...
Page 3
TABLE 2. AC ELECTRICAL PERFORMANCE CHARACTERISTICS PARAMETER SYMBOL Input to Output TPHL VCC = 4.5V TPLH VCC = 4.5V NOTES: 1. All voltages referenced to device GND measurements assume RL = 500 , CL = 50pF, Input TR ...
Page 4
TABLE 5. BURN-IN AND OPERATING LIFE TEST, DELTA PARAMETERS (+25 PARAMETER ICC IOL/IOH COMFORMANCE GROUP Initial Test Interim Test PDA Final Test Group A (Note 1) Subgroup B5 Subgroup B6 Group D NOTES: 1. Alternate Group A testing in accordance ...
Page 5
TABLE 8. STATIC AND DYNAMIC BURN-IN TEST CONNECTIONS OPEN GROUND STATIC BURN-IN I TEST CONDITIONS (Note 10 11, 12 STATIC BURN-IN II TEST CONNECTIONS (Note 10, ...
Page 6
Intersil Space Level Product Flow - ‘MS’ Wafer Lot Acceptance (All Lots) Method 5007 (Includes SEM) GAMMA Radiation Verification (Each Wafer) Method 1019, 4 Samples/Wafer, 0 Rejects 100% Nondestructive Bond Pull, Method 2023 Sample - Wire Bond Pull Monitor, Method ...
Page 7
AC Timing Diagrams VIH INPUT VS VIL TPLH VOH VS OUTPUT VOL TTLH VOH 80% 20% OUTPUT VOL FIGURE 1 AC VOLTAGE LEVELS PARAMETER HCS VCC 4.50 VIH 3.00 VS 1.30 VIL 0 GND 0 HCTS02MS AC Load Circuit TPHL ...
Page 8
Die Characteristics DIE DIMENSIONS mils 2.20mm x 2.24mm METALLIZATION: Type: SiAl Å Å Metal Thickness: 11k 1k GLASSIVATION: Type: SiO 2 Å Å Thickness: 13k 2.6k WORST CASE CURRENT DENSITY <2 A/cm BOND ...
Page 9
Packaging -A- - bbb BASE S2 PLANE -C- SEATING PLANE aaa ccc NOTES: 1. Index ...
Page 10
Packaging (Continued) e PIN NO AREA - 0.004 0.036 - SEATING AND BASE PLANE c1 LEAD FINISH BASE (c) METAL b1 ...
Page 11
All Intersil semiconductor products are manufactured, assembled and tested under ISO9000 quality systems certification. Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design and/or specifications at any time without notice. Accordingly, ...