HCTS02HMSR INTERSIL [Intersil Corporation], HCTS02HMSR Datasheet - Page 2
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HCTS02HMSR
Manufacturer Part Number
HCTS02HMSR
Description
Radiation Hardened Quad 2-Input NOR Gate
Manufacturer
INTERSIL [Intersil Corporation]
Datasheet
1.HCTS02HMSR.pdf
(11 pages)
Absolute Maximum Ratings
Supply Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.5V to +7.0V
Input Voltage Range, All Inputs . . . . . . . . . . . . .-0.5V to VCC +0.5V
DC Input Current, Any One Input
DC Drain Current, Any One Output
(All Voltage Reference to the VSS Terminal)
Storage Temperature Range (TSTG) . . . . . . . . . . . -65
Junction Temperature (TJ) . . . . . . . . . . . . . . . . . . . . . . . . . . +175
Lead Temperature (Soldering 10sec) . . . . . . . . . . . . . . . . . . +265
ESD Classification . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Class 1
CAUTION: As with all semiconductors, stress listed under “Absolute Maximum Ratings” may be applied to devices (one at a time) without resulting in permanent
damage. This is a stress rating only. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. The conditions listed
under “Electrical Performance Characteristics” are the only conditions recommended for satisfactory device operation..
Operating Conditions
Supply Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . +4.5V to +5.5V
Input Rise and Fall Times at 4.5V VCC (TR, TF) . . . . . 100ns/V Max
Operating Temperature Range (T
NOTES:
1. All voltages reference to device GND.
2. For functional tests, VO
Quiescent Current
Output Current
(Sink)
Output Current
(Source)
Output Voltage Low
Output Voltage High
Input Leakage
Current
Noise Immunity
Functional Test
PARAMETERS
SYMBOL
VOH
VOL
ICC
IOH
IOL
IIN
FN
4.0V is recognized as a logic “1”, and VO
A
) . . . . . . . . . . . . -55
TABLE 1. DC ELECTRICAL PERFORMANCE CHARACTERISTICS
VCC = 5.5V,
VIN = VCC or GND
VCC = 4.5V, VIH = 4.5V,
VOUT = 0.4V, VIL = 0V
VCC = 4.5V, VIH = 4.5V,
VOUT = VCC -0.4V,
VIL = 0V
VCC = 4.5V, VIH = 2.25V,
IOL = 50 A, VIL = 0.8V
VCC = 5.5V, VIH = 2.75V,
IOL = 50 A, VIL = 0.8V
VCC = 4.5V, VIH = 2.25V,
IOH = -50 A, VIL = 0.8V
VCC = 5.5V, VIH = 2.75V,
IOH = -50 A, VIL = 0.8V
VCC = 5.5V, VIN = VCC or
GND
VCC = 4.5V,
VIH = 2.25V,
VIL = 0.8V, (Note 2)
CONDITIONS
(NOTE 1)
Specifications HCTS02MS
o
o
C to +150
C to +125
10mA
25mA
o
o
o
o
C
C
C
C
2
GROUPS
7, 8A, 8B
GROUP
A SUB-
Reliability Information
Thermal Resistance
Maximum Package Power Dissipation at +125
If device power exceeds package dissipation capability, provide heat
sinking or derate linearly at the following rate:
Input Low Voltage (VIL). . . . . . . . . . . . . . . . . . . . . . . . . 0.0V to 0.8V
Input High Voltage (VIH) . . . . . . . . . . . . . . . . . . . . . . .VCC/2 to VCC
1, 2, 3
1, 2, 3
1, 2, 3
1, 2, 3
2, 3
2, 3
2, 3
2, 3
SBDIP Package. . . . . . . . . . . . . . . . . . . .
Ceramic Flatpack Package . . . . . . . . . . .
SBDIP Package. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0.66W
Ceramic Flatpack Package . . . . . . . . . . . . . . . . . . . . . . . . . 0.43W
SBDIP Package. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13.5mW/
Ceramic Flatpack Package . . . . . . . . . . . . . . . . . . . . . . 8.6mW/
1
1
1
1
0.5V is recognized as a logic “0”.
+25
+25
+25
+25
+25
TEMPERATURE
+125
+125
+125
o
o
o
o
+125
o
C, +125
C, +125
C, +125
C, +125
C, +125
+25
+25
+25
+25
o
o
o
o
C, -55
C, -55
C, -55
C, -55
o
o
o
o
C
C
C
o
o
o
o
C
o
C, -55
C, -55
C, -55
C, -55
C, -55
o
o
o
o
C
C
C
C
o
o
o
o
o
C
C
C
C
C
VCC
VCC
MIN
-4.8
-4.0
-0.1
-0.1
4.8
4.0
4.0
Spec Number
-
-
-
-
-
-
LIMITS
o
116
74
C
o
o
MAX
JA
C/W
200
C/W
0.1
0.1
0.5
10
0.5
5.0
-
-
-
-
-
-
24
30
UNITS
518841
mA
mA
mA
mA
o
o
V
V
V
V
V
JC
C/W
C/W
A
A
A
A
o
o
C
C