HCTS30HMSR INTERSIL [Intersil Corporation], HCTS30HMSR Datasheet

no-image

HCTS30HMSR

Manufacturer Part Number
HCTS30HMSR
Description
Radiation Hardened 8-Input NAND Gate
Manufacturer
INTERSIL [Intersil Corporation]
Datasheet
August 1995
CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures.
http://www.intersil.com or 407-727-9207
Features
• 3 Micron Radiation Hardened SOS CMOS
• Total Dose 200K RAD (Si)
• SEP Effective LET No Upsets: >100 MEV-cm
• Single Event Upset (SEU) Immunity < 2 x 10
• Dose Rate Survivability: >1 x 10
• Dose Rate Upset >10
• Latch-Up Free Under Any Conditions
• Military Temperature Range: -55
• Significant Power Reduction Compared to LSTTL ICs
• DC Operating Voltage Range: 4.5V to 5.5V
• LSTTL Input Compatibility
• Input Current Levels Ii
Description
The Intersil HCTS30MS is a Radiation Hardened 8-Input
NAND Gate. A high on all input forces the output to a low
state.
The HCTS30MS utilizes advanced CMOS/SOS technology
to achieve high-speed operation. This device is a member of
radiation hardened, high-speed, CMOS/SOS Logic Family.
Ordering Information
HCTS30DMSR
HCTS30KMSR
HCTS30D/Sample
HCTS30K/Sample
HCTS30HMSR
Bit-Day (Typ)
- VIL = 0.8V Max
- VIH = VCC/2 Min
PART NUMBER
10
RAD (Si)/s 20ns Pulse
5 A at VOL, VOH
|
Copyright
TEMPERATURE RANGE
12
o
C to +125
©
RAD (Si)/s
-55
-55
Intersil Corporation 1999
o
o
C to +125
C to +125
+25
+25
+25
o
o
o
o
C
C
C
C
2
/mg
-9
o
o
C
C
Errors/
440
Pinouts
Intersil Class S Equivalent
Intersil Class S Equivalent
Sample
Sample
Die
GND
SCREENING LEVEL
A
B
C
D
E
HCTS30MS
F
FLATPACK PACKAGE (FLATPACK)
14 LEAD CERAMIC DUAL-IN-LINE
14 LEAD CERAMIC METAL SEAL
METAL SEAL PACKAGE (SBDIP)
GND
MIL-STD-1835 CDFP3-F14
MIL-STD-1835 CDIP2-T14
A
B
C
D
E
F
1
2
3
4
5
6
7
1
2
3
4
5
6
7
TOP VIEW
TOP VIEW
Radiation Hardened
14 Lead SBDIP
14 Lead Ceramic Flatpack
14 Lead SBDIP
14 Lead Ceramic Flatpack
Die
8-Input NAND Gate
14
13
12
11
10
9
8
14
13
12
10
11
Spec Number
9
8
File Number
PACKAGE
VCC
NC
H
G
NC
NC
Y
VCC
NC
H
G
NC
NC
Y
518639
3056.1

Related parts for HCTS30HMSR

HCTS30HMSR Summary of contents

Page 1

... This device is a member of radiation hardened, high-speed, CMOS/SOS Logic Family. Ordering Information PART NUMBER TEMPERATURE RANGE HCTS30DMSR HCTS30KMSR HCTS30D/Sample HCTS30K/Sample HCTS30HMSR CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures. | http://www.intersil.com or 407-727-9207 Copyright HCTS30MS Pinouts 2 /mg ...

Page 2

Functional Diagram ...

Page 3

Absolute Maximum Ratings Supply Voltage (VCC -0.5V to +7.0V Input Voltage Range, All Inputs . . ...

Page 4

TABLE 2. AC ELECTRICAL PERFORMANCE CHARACTERISTICS PARAMETER SYMBOL Input to Output TPHL VCC = 4.5V TPLH VCC = 4.5V NOTES: 1. All voltages referenced to device GND measurements assume RL = 500 , CL = 50pF, Input TR ...

Page 5

TABLE 4. DC POST RADIATION ELECTRICAL PERFORMANCE CHARACTERISTICS (Continued) PARAMETER SYMBOL Noise Immunity FN Functional Test Input to Output TPHL TPLH NOTES: 1. All voltages referenced to device GND measurements assume RL = 500 , CL = 50pF, ...

Page 6

CONFORMANCE GROUPS METHOD Group E Subgroup 2 5005 NOTE: 1. Except FN test which will be performed 100% Go/No-Go. TABLE 8. STATIC AND DYNAMIC BURN-IN TEST CONNECTIONS OPEN GROUND STATIC BURN-IN I TEST CONNECTIONS (Note 10, 13 ...

Page 7

Intersil Space Level Product Flow - ‘MS’ Wafer Lot Acceptance (All Lots) Method 5007 (Includes SEM) GAMMA Radiation Verification (Each Wafer) Method 1019, 4 Samples/Wafer, 0 Rejects 100% Nondestructive Bond Pull, Method 2023 Sample - Wire Bond Pull Monitor, Method ...

Page 8

AC Timing Diagrams VIH INPUT VS VIL TPLH VOH VS OUTPUT VOL TTLH VOH 80% 20% OUTPUT VOL AC VOLTAGE LEVELS PARAMETER HCTS VCC 4.50 VIH 3.00 VS 1.30 VIL 0 GND 0 HCTS30MS AC Load Circuit TPHL TTHL 80% ...

Page 9

Die Characteristics DIE DIMENSIONS mils METALLIZATION: Type: SiAl Å Å Metal Thickness: 11k 1k GLASSIVATION: Type: SiO 2 Å Å Thickness: 13k 2.6k WORST CASE CURRENT DENSITY <2 A/cm BOND PAD SIZE: 100 ...

Page 10

All Intersil semiconductor products are manufactured, assembled and tested under ISO9000 quality systems certification. Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design and/or specifications at any time without notice. Accordingly, ...

Related keywords