HCTS30HMSR INTERSIL [Intersil Corporation], HCTS30HMSR Datasheet - Page 6

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HCTS30HMSR

Manufacturer Part Number
HCTS30HMSR
Description
Radiation Hardened 8-Input NAND Gate
Manufacturer
INTERSIL [Intersil Corporation]
Datasheet
NOTE:
NOTES:
1. Except FN test which will be performed 100% Go/No-Go.
1. Each pin except VCC and GND will have a resistor of 10K
2. Each pin except VCC and GND will have a resistor of 1K
Group E Subgroup 2
STATIC BURN-IN I TEST CONNECTIONS (Note 1)
STATIC BURN-IN II TEST CONNECTIONS (Note 1)
DYNAMIC BURN-IN TEST CONNECTIONS (Note 2)
CONFORMANCE
8, 9, 10, 13
8, 9, 10, 13
9, 10, 13
OPEN
GROUPS
NOTE: Each pin except VCC and GND will have a resistor of 47K
8, 9, 10, 13
Group E, Subgroup 2, sample size is 4 dice/wafer 0 failures.
1 - 5, 6, 7, 11, 12
OPEN
GROUND
METHOD
TABLE 8. STATIC AND DYNAMIC BURN-IN TEST CONNECTIONS
5005
7
7
TABLE 9. IRRADIATION TEST CONNECTIONS
Specifications HCTS30MS
TABLE 7. TOTAL DOSE IRRADIATION
1/2 VCC = 3V 0.5V
PRE RAD
1, 7, 9
GROUND
7
8
-
-
5% for dynamic burn-in
5% for static burn-in
445
TEST
POST RAD
1 - 5, 6, 11, 12, 14
VCC = 6V
Table 4
1, 2, 3, 4, 5, 6, 11, 12, 14
14
14
VCC = 5V
0.5V
5% for irradiation testing.
PRE RAD
0.5V
1 - 5, 6, 11, 12
1, 9
READ AND RECORD
50kHz
-
-
OSCILLATOR
Spec Number
Table 4 (Note 1)
POST RAD
25kHz
-
-
-
518639

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