TGA2527-SM TRIQUINT [TriQuint Semiconductor], TGA2527-SM Datasheet - Page 11

no-image

TGA2527-SM

Manufacturer Part Number
TGA2527-SM
Description
Ku-Band Power Amplifier
Manufacturer
TRIQUINT [TriQuint Semiconductor]
Datasheet

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
TGA2527-SM
Manufacturer:
QORVO
Quantity:
243
TGA2527-SM
Ku-Band Power Amplifier
Mechanical Information (cont.)
All dimensions are in millimeters (inches).
Notes:
1. A heatsink underneath the area of the PCB for the mounted device
2. Ground / thermal vias are critical for the proper performance of this device.
Tape and reel specifications for this part are also available on the TriQuint website in the “Application Notes” section.
Standard T/R size = 500 pieces on a 7 x 0.5” reel.
CARRIER AND COVER TAPE DIMENSIONS
Preliminary Data Sheet: Rev - 11/21/11
© 2011 TriQuint Semiconductor, Inc.
Mounting Configuration
Tape and Reel Information
Part
Cavity
Distance Between Centerline
Cover Tape
Carrier Tape
is recommended for proper thermal operation.
Vias have a final plated thru diameter of .40 mm (.016”).
Feature
Length
Width
Depth
Pitch
Cavity to Perforation
Length Direction
Cavity to Perforation
Width Direction
Width
Width
- 11 of 13 -
Connecting the Digital World to the Global Network
Symbol
A0
K0
B0
P1
P2
W
C
F
Disclaimer: Subject to change without notice
Size (in)
0.207
0.207
0.043
0.315
0.079
0.217
0.374
0.472
Size (mm)
.675
5.25
5.25
1.10
8.00
2.00
5.50
12.0
9.5
®
.675

Related parts for TGA2527-SM