HMC580ST89_10 HITTITE [Hittite Microwave Corporation], HMC580ST89_10 Datasheet - Page 4

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HMC580ST89_10

Manufacturer Part Number
HMC580ST89_10
Description
InGaP HBT GAIN BLOCK MMIC AMPLIFIER, DC - 1 GHz
Manufacturer
HITTITE [Hittite Microwave Corporation]
Datasheet
Absolute Maximum Ratings
Outline Drawing
Package Information
Collector Bias Voltage (Vcc)
RF Input Power (RFIN)(Vcc = +4.2 Vdc)
Junction Temperature
Continuous Pdiss (T = 85 °C)
(derate 9 mW/°C above 85 °C)
Thermal Resistance
(junction to lead)
Storage Temperature
Operating Temperature
ESD Sensitivity (HMB)
[1] Max peak refl ow temperature of 235 °C
[2] Max peak refl ow temperature of 260 °C
[3] 4-Digit lot number XXXX
HMC580ST89E
For price, delivery and to place orders: Hittite Microwave Corporation, 20 Alpha Road, Chelmsford, MA 01824
HMC580ST89
Part Number
Phone: 978-250-3343
RoHS-compliant Low Stress Injection Molded Plastic
Application Support: Phone: 978-250-3343 or apps@hittite.com
Low Stress Injection Molded Plastic
Package Body Material
+5.5 Vdc
+10 dBm
150 °C
0.59 W
110 °C/W
-65 to +150 °C
-40 to +85 °C
Class 1C
v04.0710
Fax: 978-250-3373
NOTES:
1. PACKAGE BODY MATERIAL:
2. LEAD MATERIAL: Cu w/ Ag SPOT PLATING.
3. LEAD PLATING: 100% MATTE TIN.
4. DIMENSIONS ARE IN INCHES [MILLIMETERS]
5. DIMENSION DOES NOT INCLUDE MOLDFLASH OF 0.15mm PER SIDE.
6. DIMENSION DOES NOT INCLUDE MOLDFLASH OF 0.25mm PER SIDE.
7. ALL GROUND LEADS MUST BE SOLDERED TO PCB RF GROUND.
MOLDING COMPOUND MP-180S OR EQUIVALENT.
HMC580ST89 / 580ST89E
100% matte Sn
Sn/Pb Solder
Order On-line at www.hittite.com
Lead Finish
MMIC AMPLIFIER, DC - 1 GHz
ELECTROSTATIC SENSITIVE DEVICE
OBSERVE HANDLING PRECAUTIONS
InGaP HBT GAIN BLOCK
MSL Rating
MSL1
MSL1
[1]
[2]
Package Marking
XXXX
XXXX
H580
H580
[3]
8 - 149
8

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