K4X51163PE-L SAMSUNG [Samsung semiconductor], K4X51163PE-L Datasheet - Page 9

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K4X51163PE-L

Manufacturer Part Number
K4X51163PE-L
Description
32Mx16 Mobile DDR SDRAM
Manufacturer
SAMSUNG [Samsung semiconductor]
Datasheet
K4X51163PE - L(F)E/G
9.3. Internal Temperature Compensated Self Refresh (TCSR)
1. In order to save power consumption, Mobile DDR SDRAM includes the internal temperature sensor and control units to control the self
refresh cycle automatically according to the two temperature ranges ; 45 °C and 85 °C.
2. If the EMRS for external TCSR is issued by the controller, this EMRS code for TCSR is ignored.
NOTE :
1) It has +/- 5 °C tolerance.
9.4. Partial Array Self Refresh (PASR)
1. In order to save power consumption, Mobile DDR SDRAM includes PASR option.
2. Mobile DDR SDRAM supports three kinds of PASR in self refresh mode; Full array, 1/2 Array, 1/4 Array.
Temperature Range
45 °C
85 °C
BA1=0
BA0=0
BA1=1
BA0=0
- Full Array
1)
BA1=0
BA0=1
BA1=1
BA0=1
Full Array
300
600
Figure 4. EMRS code and TCSR , PASR
1/2 Array
270
500
- E
BA1=0
BA0=0
BA1=1
BA0=0
- 1/2 Array
Self Refresh Current (IDD6)
1/4 Array
255
450
- 12 -
BA1=0
BA0=1
BA1=1
BA0=1
Full Array
250
500
1/2 Array
220
400
- G
Mobile DDR SDRAM
BA1=0
BA0=0
BA1=1
BA0=0
Partial Self Refresh Area
- 1/4 Array
1/4 Array
205
350
BA1=0
BA0=1
BA1=1
BA0=1
June 2007
Unit
uA

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