MAL214095001E3 VISHAY [Vishay Siliconix], MAL214095001E3 Datasheet - Page 2

• Manufacturer Part Number: MAL214095001E3
• Description: Aluminum Capacitors SMD (Chip), High Temperature
• Manufacturer: VISHAY [Vishay Siliconix]

140 CLH
Vishay BCcomponents
Table 1
Table 2
Note
1. Detailed tape dimensions see section “PACKAGING”.
MOUNTING
The capacitors are designed for automatic placement on to
printed-circuit boards.
Optimum dimensions of soldering pads depend amongst
others on soldering method, mounting accuracy, print lay-out
and/or adjacent components.
For recommended soldering pad dimensions, refer to Fig.3
and Table 3.
SOLDERING
Soldering conditions are defined by the curve, temperature
versus time, where the temperature is that measured on the
soldering pad during processing.
For maximum conditions refer to Fig.4.
Any temperature versus time curve which does not exceed
the specified maximum curves may be applied.
Table 3
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2
CASE CODE
DIMENSIONS in millimeters AND MASS
TAPE AND REEL DIMENSIONS in millimeters, PACKAGING QUANTITIES
RECOMMENDED SOLDERING PAD
DIMENSIONS in millimeters
10 x 10 x 10
10 x 10 x 14
10 x 10 x 10
10 x 10 x 14
CASE SIZE
CASE SIZE
0810
1010
1014
L x W x H
NOMINAL
L x W x H
NOMINAL
8 x 8 x 10
8 x 8 x 10
3.5
4.3
4.3
a
CODE
CODE
CASE
CASE
0810
1010
1014
0810
1010
1014
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L
10.5
10.5
8.5
PITCH
max.
0.4 ± 0.2
2.5
2.5
2.5
16
16
16
b
P
1
W B
W
10.5
10.5
SMD (Chip), High Temperature
8.5
max.
C
TAPE WIDTH
S
Aluminum Capacitors
L
3.0
4.0
4.0
c
Fig.2 Dimensional outline
H
C
10.5
10.5
14.3
24
24
24
W
max.
10.0
10.0
Ø D
8.0
AS A GENERAL PRINCIPLE, TEMPERATURE AND
DURATION SHALL BE THE MINIMUM NECESSARY
REQUIRED
CONNECTIONS. HOWEVER, THE SPECIFIED MAXIMUM
CURVES SHOULD NEVER BE EXCEEDED.
T
(°C)
TAPE THICKNESS
0.3 max.
Pad
Fig. 4 Maximum temperature load during infrared reflow
H
280
260
240
220
200
180
160
140
120
100
80
Fig. 3 Recommended solder pad dimensions
B
1.0
1.0
1.0
11.3
11.3
14.8
max.
0
T
soldering measured on the soldering pad
2
TO
D
50
a
ENSURE
3.1
4.5
4.5
S
100
c
REEL DIA.
380
380
330
a
150
GOOD
Document Number: 28303
L
11.8
11.8
1 max.
9.9
Revision: 29-May-08
200
PACKAGING
b
QUANTITY
PER REEL
SOLDERING
t (s)
500
500
250
MASS
≈ 1.3
≈ 1.5
≈ 1.0
250
(g)