SST89E554RC-40-C-NJE Silicon Storage Tech, SST89E554RC-40-C-NJE Datasheet - Page 87

• Manufacturer Part Number: SST89E554RC-40-C-NJE
• Description: Semiconductors and Actives, Microprocessors, Microcontrollers
• Manufacturer: Silicon Storage Tech

FlashFlex MCU
SST89E564RD / SST89V564RD
SST89E554RC / SST89V554RC
15.0 PACKAGING DIAGRAMS
©2007 Silicon Storage Technology, Inc.
40-
SST P
40-
SST P
Pin #1
Note: 1. Complies with JEDEC JEP95 MO-220I, variant WJJD-5 except external paddle nominal dimensions.
CONTACT
Seating Plane
PIN
Base Plane
ACKAGE
ACKAGE
P
2. From the bottom view, the pin #1 indicator may be either a 45-degree chamfer or a half-circle notch.
3. The external paddle is electrically connected to the die back-side and possibly to certain V
4. Untoleranced dimensions (shown with box surround) are nominal target dimensions.
5. All linear dimensions are in millimeters (max/min).
LASTIC
This paddle can be soldered to the PC board; it is suggested to connect this paddle to the V
Connection of this paddle to any other voltage potential can result in shorts and/or electrical malfunction of the device.
Note:
V
Pin #1 Identifier
ERY
C
C
.015 Min.
D
1. Complies with JEDEC publication 95 MS-011 AC dimensions (except as noted), although some dimensions may be more stringent.
2. All linear dimensions are in inches (min/max).
3. Dimensions do not include mold flash. Maximum allowable mold flash is .010 inches.
ODE
ODE
UAL
-
† = JEDEC min is .115; SST min is less stringent
TOP VIEW
.065
.075
VERY
6.00 ± 0.10
: QI
: PI
I
N
.063
.090
-
-
LINE
THIN
40
1
P
Q
INS
UAD
.045
.055
(PDIP)
F
LAT
2.020
2.070
6.00 ± 0.10
N
O
.015
.022
-
LEAD
SIDE VIEW
0.80
0.70
(WQFN)
.100 BSC
87
0.05 Max
0.2
0.076
C L
.100 †
.200
.220 Max.
SS
SS
leads.
.008
.012
BOTTOM VIEW
of the unit.
4 places
4.1
12˚
4.1
.600 BSC
.600
.625
.530
.557
40-pdip-PI-7
40-wqfn-6x6-QI-0.0
S71207-08-EOL
EOL Data Sheet
1mm
See notes
2 and 3
0.5 BSC
Pin #1
0.45
0.35
0.30
0.18
15˚
0˚
1/07