IS46TR16128A-15HBLA2 ISSI, IS46TR16128A-15HBLA2 Datasheet - Page 30

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IS46TR16128A-15HBLA2

Manufacturer Part Number
IS46TR16128A-15HBLA2
Description
DRAM 2G, 1.5v, 1333MT/s 128Mx16 DDR3
Manufacturer
ISSI

Specifications of IS46TR16128A-15HBLA2

Rohs
yes
Data Bus Width
16 bit
Organization
128 M x 16
Package / Case
FBGA-96
Memory Size
2 Gbit
Maximum Clock Frequency
933 MHz
Access Time
13.125 ns
Supply Voltage - Max
1.575 V
Supply Voltage - Min
1.425 V
Maximum Operating Current
65 mA
Maximum Operating Temperature
+ 105 C
Minimum Operating Temperature
- 40 C
Mounting Style
SMD/SMT
IS43/46TR16128A, IS43/46TR16128AL,
IS43/46TR82560A, IS43/46TR82560AL
3. ABSOLUTE MAXIMUM RATINGS AND AC & DC OPERATING CONDITIONS
3.1 Absolute Maximum DC Ratings.
Notes:
1. Stresses greater than those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress rating only and
2. Storage Temperature is the case surface temperature on the center/top side of the DRAM. For the measurement conditions.
3.
3.2 Component Operating Temperature Range
Notes:
1. Operating Temperature TOPER is the case surface temperature on the center / top side of the DRAM.
2. The Normal Temperature Range specifies the temperatures where all DRAM specifications will be supported. During operation, the DRAM case
3. Some applications require operation of the DRAM in the Extended Temperature Range above 85°C case temperature. Full specifications are
3.3 Recommended DC Operating Conditions(SSTL_1.5)
Notes:
1. Under all conditions VDDQ must be less than or equal to VDD.
2.
3. Maximum DC value may not be greater than 1.425V. The DC value is the linear average of V
4. If the limit is exceeded, the input levels are covered by the DDR3 specification.
5. With these supply voltages, the device operates with DDR3L specifications.
6. After initialized for DDR3 operation, the DDR3L may be used only upon reset.
Integrated Silicon Solution, Inc. – www.issi.com –
Rev. 00A
11/14/2012
Toper for Industrial and
Toper for Commercial
Toper for Automotive
functional operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not
implied. Exposure to absolute maximum rating conditions for extended periods may affect reliability.
VDD and VDDQ must be within 300 mV of each other at all times; and VREF must be not greater than 0.6 x VDDQ, When VDD and VDDQ are less
than 500 mV; VREF may be equal to or less than 300 mV
temperature must be maintained between 0 to 85°C under all operating conditions
supported in this range, but the following additional conditions apply:
a ) Refresh commands must be doubled in frequency, therefore reducing the Refresh interval tREFI to 3.9 µs.
b) If Self-Refresh operation is required in the Extended Temperature Range, then it is mandatory to either use the Manual Self-Refresh mode with
Extended Temperature Range capability (MR2 A6 = 0b and MR2 A7 = 1b) or enable the optional Auto Self-Refresh mode (MR2 A6 = 1b and MR2
A7 = 0b).
VDDQ tracks with VDD. AC parameters are measured with VDD and VDDQ tied together.
Symbol
VDDQ
VDD
VIN, VOUT
Automotive
(A2 only)
Symbol
Symbol
VDDQ
TSTG
VDD
Supply Voltage
Supply Voltage
for Output
Parameter
Normal Operating Temperature Range
Normal Operating Temperature Range
Normal Operating Temperature Range
Voltage on VDDQ pin relative to Vss
Voltage on VDD pin relative to Vss
Voltage on any pin relative to Vss
Extended Temperature Range
Storage Temperature
DDR3L
DDR3L
DDR3
DDR3
Parameter
Parameter
1.425
1.283
1.425
1.283
Min
Rating
1.35
1.35
Typ
1.5
1.5
-0.4 V ~ 1.975 V
-0.4 V ~ 1.975 V
-0.4 V ~ 1.975 V
DD
-55 to +100
95 to 105
85 to 95
/V
-40 to 0
0 to 85
Rating
Rating
DD
(t) over a long period of time.
1.575
1.575
Max
1.45
1.45
Units
Units
Unit
°C
°C
°C
°C
°C
V
V
V
V
V
V
V
3,4,5,6
3,4,5,6
Notes
Notes
30
Note
1,3
1,3
1,2
1,2
1,3
1,3
1,2
1,2
1
1

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