SSTUM32866EC/S,518 NXP Semiconductors, SSTUM32866EC/S,518 Datasheet - Page 28

IC BUFFER 1.8V 25BIT 96-LFBGA

SSTUM32866EC/S,518

Manufacturer Part Number
SSTUM32866EC/S,518
Description
IC BUFFER 1.8V 25BIT 96-LFBGA
Manufacturer
NXP Semiconductors
Datasheet

Specifications of SSTUM32866EC/S,518

Logic Type
1:1, 1:2 Configurable Registered Buffer with Parity
Supply Voltage
1.7 V ~ 2 V
Number Of Bits
25, 14
Operating Temperature
0°C ~ 85°C
Mounting Type
Surface Mount
Package / Case
96-LFBGA
Logic Family
SSTU
Logical Function
Registered Buffer
Number Of Elements
1
Number Of Inputs
25
Number Of Outputs
25
High Level Output Current
-8mA
Low Level Output Current
8mA
Package Type
LFBGA
Propagation Delay Time
3ns
Operating Supply Voltage (typ)
1.8V
Operating Supply Voltage (max)
2V
Operating Supply Voltage (min)
1.7V
Clock-edge Trigger Type
Posit/Negat-Edge
Polarity
Non-Inverting
Technology
CMOS
Mounting
Surface Mount
Pin Count
96
Operating Temp Range
0C to 85C
Operating Temperature Classification
Commercial
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
935284578518
SSTUM32866EC/S-T
SSTUM32866EC/S-T

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
SSTUM32866EC/S,518
Manufacturer:
NXP Semiconductors
Quantity:
10 000
NXP Semiconductors
18. Contents
1
2
3
4
4.1
5
6
6.1
6.2
7
7.1
8
9
10
10.1
11
11.1
11.2
11.3
11.4
12
13
13.1
13.2
13.3
13.4
14
15
16
16.1
16.2
16.3
16.4
17
18
General description . . . . . . . . . . . . . . . . . . . . . . 1
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
Ordering information . . . . . . . . . . . . . . . . . . . . . 2
Functional diagram . . . . . . . . . . . . . . . . . . . . . . 3
Pinning information . . . . . . . . . . . . . . . . . . . . . . 5
Functional description . . . . . . . . . . . . . . . . . . . 8
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . 10
Recommended operating conditions. . . . . . . 11
Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . 12
Test information . . . . . . . . . . . . . . . . . . . . . . . . 17
Package outline . . . . . . . . . . . . . . . . . . . . . . . . 23
Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . 26
Revision history . . . . . . . . . . . . . . . . . . . . . . . . 26
Legal information. . . . . . . . . . . . . . . . . . . . . . . 27
Contact information. . . . . . . . . . . . . . . . . . . . . 27
Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28
Ordering options . . . . . . . . . . . . . . . . . . . . . . . . 2
Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 7
Function table . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Timing diagrams . . . . . . . . . . . . . . . . . . . . . . . 14
Parameter measurement information for
data output load circuit . . . . . . . . . . . . . . . . . . 17
Data output slew rate measurement
information . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
Error output load circuit and voltage
measurement information . . . . . . . . . . . . . . . . 20
Partial parity out load circuit and voltage
measurement information . . . . . . . . . . . . . . . . 21
Introduction to soldering . . . . . . . . . . . . . . . . . 24
Wave and reflow soldering . . . . . . . . . . . . . . . 24
Wave soldering . . . . . . . . . . . . . . . . . . . . . . . . 24
Reflow soldering . . . . . . . . . . . . . . . . . . . . . . . 25
Data sheet status . . . . . . . . . . . . . . . . . . . . . . 27
Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27
Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 27
Trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . . 27
1.8 V DDR2-1G configurable registered buffer with parity
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
© NXP B.V. 2007.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
SSTUM32866
Document identifier: SSTUM32866_1
Date of release: 29 June 2007
All rights reserved.

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