MPC8536EBVTATLA Freescale Semiconductor, MPC8536EBVTATLA Datasheet - Page 111

• Manufacturer Part Number: MPC8536EBVTATLA
• Description: Microprocessors - MPU 8536 ENCRYPTED
• Manufacturer: Freescale Semiconductor

Specifications of MPC8536EBVTATLA

• Product Category: Microprocessors - MPU
• Rohs: yes
• Processor Series: PowerQUICC III
• Core: e500
• Data Bus Width: 32 bit
• Maximum Clock Frequency: 250 MHz
• Program Memory Size: 32 KB
• Data Ram Size: 512 KB
• Interface Type: I2C, USB
• Operating Supply Voltage: 3.3 V
• Maximum Operating Temperature: 0 C to + 105 C
• Mounting Style: SMD/SMT
• Package / Case: MAPBGA-783

Electrical Characteristics
Figure 72. System-Level Thermal Model for the Chip (Not to Scale)
The Flotherm library files of the parts have a dense grid to accurately capture the laminar boundary layer for flow over the part
in standard JEDEC environments, as well as the heat spreading in the board under the package. In a real system, however, the
part will require a heat sink to be mounted on it. In this case, the predominant heat flow path will be from the die to the heat
sink. Grid density lower than currently in the package library file will suffice for these simulations. The user will need to
determine the optimal grid for their specific case.
2.24.3
Thermal Management Information
This section provides thermal management information for the flip chip plastic ball grid array (FC-PBGA) package for
air-cooled applications. Proper thermal control design is primarily dependent on the system-level design—the heat sink, airflow,
and thermal interface material.
MPC8535E PowerQUICC III Integrated Processor Hardware Specifications, Rev. 5
Freescale Semiconductor
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