M24C64-DFMN6TP STMicroelectronics, M24C64-DFMN6TP Datasheet - Page 38
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M24C64-DFMN6TP
Manufacturer Part Number
M24C64-DFMN6TP
Description
EEPROM 64 Kbit Serial I2C 1.7V to 5.5V EEPROM
Manufacturer
STMicroelectronics
Datasheet
1.M24C64-WBN6.pdf
(42 pages)
Specifications of M24C64-DFMN6TP
Product Category
EEPROM
Rohs
yes
Available stocks
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Part Number
Manufacturer
Quantity
Price
Package mechanical data
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Figure 21. Thin WLCSP 8-bump wafer-length chip-scale package outline
1. Drawing is not to scale.
2. The index on the wafer back side (circle) is above the index of the bump side (triangle/arrow).
Table 23.
1. These data are preliminary.
2. Values in inches are converted from mm and rounded to four decimal digits.
3. Dimension measured at the maximum bump diameter parallel to primary datum Z.
Symbol
aaa
eee
b
A1
A2
e1
e2
D
G
A
E
F
e
Thin WLCSP 8-bump wafer-length chip-scale package mechanical data
(3)
Doc ID 16891 Rev 27
0.315
0.115
0.200
0.160
1.073
0.959
0.693
0.800
0.400
0.133
0.137
0.110
0.060
Typ
millimeters
0.300
Min
M24C64-W M24C64-R M24C64-F M24C64-DF
0.330
1.093
0.979
Max
0.00524
0.0124
0.0045
0.0079
0.0063
0.0422
0.0378
0.0273
0.0315
0.0157
0.0052
0.0043
0.0043
Typ
inches
0.0118
Min
(2)
0.0130
0.0430
0.0385
Max
(1)