LPC1788FBD144,551 NXP Semiconductors, LPC1788FBD144,551 Datasheet - Page 109
LPC1788FBD144,551
Manufacturer Part Number
LPC1788FBD144,551
Description
8-bit Microcontrollers - MCU CORTEX-M3 512KB FL 96KB SRAM 4KB EE USB
Manufacturer
NXP Semiconductors
Datasheet
1.LPC1778FBD144551.pdf
(120 pages)
Specifications of LPC1788FBD144,551
Rohs
yes
Factory Pack Quantity
60
- Current page: 109 of 120
- Download datasheet (2Mb)
NXP Semiconductors
Fig 43. TFBGA180 package
LPC178X_7X
Product data sheet
TFBGA180: thin fine-pitch ball grid array package; 180 balls; body 12 x 12 x 0.8 mm
DIMENSIONS (mm are the original dimensions)
UNIT
mm
OUTLINE
VERSION
SOT570-2
ball A1
index area
ball A1
index area
max.
1.2
A
0.35
0.25
A
M
G
1
P
N
L
K
H
F
E
D
C
B
A
J
0.85
0.75
1
A
2
2
e
IEC
3
0.5
0.4
b
4
5
12.2
11.8
6
D
7
e
D
1
12.2
11.8
8
E
All information provided in this document is subject to legal disclaimers.
9
1/2 e
JEDEC
10
0.8
0
11
e
Rev. 4.1 — 15 November 2012
REFERENCES
12
b
10.4
13 14
e
1
10.4
e
1/2 e
2
JEITA
scale
B
e
5
∅ w
∅ v
0.15
e
A
v
E
2
M
M
C
C
0.08
w
A
B
0.12
y
10 mm
A
32-bit ARM Cortex-M3 microcontroller
A
0.1
y
2
1
y
1
A
C
1
PROJECTION
EUROPEAN
detail X
LPC178x/7x
C
X
y
© NXP B.V. 2012. All rights reserved.
ISSUE DATE
03-03-03
06-03-14
SOT570-2
109 of 120
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