NTS0102DP,125 NXP Semiconductors, NTS0102DP,125 Datasheet
NTS0102DP,125
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NTS0102DP,125 Summary of contents
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NTS0102 Dual supply translating transceiver; open drain; auto direction sensing Rev. 4 — 23 January 2013 1. General description The NTS0102 is a 2-bit, dual supply translating transceiver with auto direction sensing, that enables bidirectional voltage level translation. It features ...
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... NXP Semiconductors 4. Ordering information Table 1. Ordering information Type number Package Temperature range 40 C to +125 C NTS0102DP 40 C to +125 C NTS0102GT 40 C to +125 C NTS0102GD 40 C to +125 C NTS0102GF 40 C to +125 C NTS0102GU 40 C to +125 C NTS0102GU8 5 ...
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... NXP Semiconductors 6. Functional diagram Fig 1. Logic symbol 7. Pinning information 7.1 Pinning NTS0102 1 B2 GND CC( 001aam488 Fig 2. Pin configuration SOT505-2 (TSSOP8) NTS0102 Product data sheet Dual supply translating transceiver; open drain; auto direction sensing GATE BIAS CC(A) GATE BIAS ...
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... NXP Semiconductors NTS0102 B2 1 GND CC( Transparent top view Fig 4. Pin configuration SOT996-2 (XSON8) Fig 6. Pin configuration SOT1309-1 (XQFN8) NTS0102 Product data sheet Dual supply translating transceiver; open drain; auto direction sensing CC( 001aam490 Fig 5. Pin configuration SOT1160-1 (XQFN10) ...
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... NXP Semiconductors 7.2 Pin description Table 3. Pin description Symbol Pin SOT505-2, SOT833-1, SOT1089 and SOT996-2 B2 GND CC(A) A2 CC(B) n. Functional description [1] Table 4. Function table Supply voltage V V CC(A) CC( 5.5 V CC( 5.5 V CC(B) [2] [2] GND GND [ HIGH voltage level LOW voltage level don’t care high-impedance OFF-state. ...
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... NXP Semiconductors Table 5. Limiting values …continued In accordance with the Absolute Maximum Rating System (IEC 60134). Voltages are referenced to GND (ground = 0 V). Symbol Parameter I ground current GND T storage temperature stg P total power dissipation tot [1] The minimum input and minimum output voltage ratings may be exceeded if the input and output current ratings are observed. ...
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... NXP Semiconductors Table 7. Typical static characteristics At recommended operating conditions; voltages are referenced to GND (ground = 0 V); T Symbol Parameter Conditions C input/output A port I/O capacitance B port port the supply voltage associated with the output. CCO Table 8. Typical supply current At recommended operating conditions; voltages are referenced to GND (ground = 0 V); T ...
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... NXP Semiconductors Table 9. Static characteristics At recommended operating conditions; voltages are referenced to GND (ground = 0 V). Symbol Parameter Conditions I input leakage OE input current V CC(A) V CC(B) I OFF-state port output current V CC(A) V CC(B) I power-off A port; V OFF leakage V CC(A) current B port CC(B) I supply current ...
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... NXP Semiconductors Dynamic characteristics for temperature range 40 C to +85 C Table 10. Voltages are referenced to GND (ground = 0 V); for test circuit see Symbol Parameter Conditions t enable time disable time external load dis external load ...
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... NXP Semiconductors Dynamic characteristics for temperature range 40 C to +85 C Table 10. Voltages are referenced to GND (ground = 0 V); for test circuit see Symbol Parameter Conditions t HIGH to LOW PHL propagation delay t LOW to HIGH PLH propagation delay t enable time ...
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... NXP Semiconductors Dynamic characteristics for temperature range 40 C to +125 C Table 11. Voltages are referenced to GND (ground = 0 V); for test circuit see Symbol Parameter Conditions t disable time external load dis external load LOW to HIGH ...
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... NXP Semiconductors Dynamic characteristics for temperature range 40 C to +125 C Table 11. Voltages are referenced to GND (ground = 0 V); for test circuit see Symbol Parameter Conditions t HIGH to LOW PHL propagation delay t LOW to HIGH PLH propagation delay t enable time ...
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... NXP Semiconductors OE input output LOW-to-OFF OFF-to-LOW output HIGH-to-OFF OFF-to-HIGH Measurement points are given in V and V are typical output voltage levels that occur with the output load Fig 8. Enable and disable times Table 12. Measurement points Supply voltage ...
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... NXP Semiconductors Test data is given in Table All input pulses are supplied by generators having the following characteristics: PRR 10 MHz Load resistance Load capacitance including jig and probe capacitance External voltage for measuring switching times. EXT Fig 9. Test circuit for measuring switching times Table 13 ...
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... NXP Semiconductors 14. Application information 14.1 Applications Voltage level-translation applications. The NTS0102 can be used in point-to-point applications to interface between devices or systems operating at different supply voltages. The device is primarily targeted at I may also be used in applications where push-pull drivers are connected to the ports, however the NTB0102 may be more suitable. ...
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... NXP Semiconductors The gate bias voltage of the pass gate transistor (T3) is set at approximately one threshold voltage above the V transition the output one-shot accelerates the output transition by switching on the PMOS transistors (T1, T2) bypassing the 10 k pull-up resistors and increasing current drive capability ...
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... NXP Semiconductors 14.7 Pull-up or pull-down resistors on I/Os lines Each A port I/O has an internal 10 k pull-up resistor internal 10 k pull-up resistor external resistor must be added parallel to the internal 10 k, this will effect the V level. When OE goes LOW the internal pull-ups of the NTS0102 are disabled. ...
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... NXP Semiconductors 15. Package outline TSSOP8: plastic thin shrink small outline package; 8 leads; body width 3 mm; lead length 0 pin 1 index 1 e DIMENSIONS (mm are the original dimensions UNIT max. 0.15 0.95 mm 1.1 0.25 0.00 0.75 Note 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. ...
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... NXP Semiconductors XSON8: plastic extremely thin small outline package; no leads; 8 terminals; body 1 x 1. 8× (2) terminal 1 index area DIMENSIONS (mm are the original dimensions) ( UNIT b D max max 0.25 2.0 mm 0.5 0.04 0.17 1.9 Notes 1. Including plating thickness. 2. Can be visible in some manufacturing processes. ...
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... NXP Semiconductors XSON8: plastic extremely thin small outline package; no leads; 8 terminals; body 0.5 mm terminal 1 index area Dimensions (mm are the original dimensions) (1) Unit max 0.05 0.35 2.1 mm nom 0.5 min 0.00 0.15 1.9 Outline version IEC SOT996-2 Fig 14. Package outline SOT996-2 (XSON8) NTS0102 Product data sheet Dual supply translating transceiver ...
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... NXP Semiconductors XSON8: extremely thin small outline package; no leads; 8 terminals; body 1. 0.5 mm terminal 1 index area (2) (4× terminal 1 index area Dimensions (1) Unit max 0.5 0.04 0.20 1.40 mm nom 0.15 1.35 min 0.12 1.30 Note 1. Including plating thickness. 2. Visible depending upon used manufacturing technology. Outline version ...
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... NXP Semiconductors XQFN10: plastic, extremely thin quad flat package; no leads; 10 terminals; body 1.40 x 1. terminal 1 index area terminal 1 index area Dimensions (1) Unit max 0.5 0.05 0.25 mm nom 0.127 0.20 min 0.00 0.15 Note 1. Plastic or metal protrusions of 0.075 mm maximum per side are not included. ...
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... NXP Semiconductors XQFN8: plastic, extremely thin quad flat package; no leads; 8 terminals; body 1.4 x 1.2 x 0.5 mm terminal 1 index area terminal 1 index area Dimensions Unit max 0.50 0.025 0.25 1.45 1.25 mm nom 0.127 0.20 1.40 1.20 0.00 0.15 1.35 1.15 min Note 1. Plastic or metal protrusions of 0.075 mm maximum per side are not included ...
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... NXP Semiconductors 16. Abbreviations Table 14. Abbreviations Acronym Description CDM Charged Device Model CMOS Complementary Metal Oxide Semiconductor DUT Device Under Test ESD ElectroStatic Discharge GPIO General Purpose Input Output HBM Human Body Model Inter-Integrated Circuit MM Machine Model PCB Printed Circuit Board ...
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... Terms and conditions of commercial sale of NXP Semiconductors. Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice ...
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... NXP Semiconductors’ specifications such use shall be solely at customer’s own risk, and (c) customer fully indemnifies NXP Semiconductors for any liability, damages or failed product claims resulting from customer design and use of the product for automotive applications beyond NXP Semiconductors’ ...
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... NXP Semiconductors 20. Contents 1 General description . . . . . . . . . . . . . . . . . . . . . . 1 2 Features and benefits . . . . . . . . . . . . . . . . . . . . 1 3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 4 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 5 Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 6 Functional diagram . . . . . . . . . . . . . . . . . . . . . . 3 7 Pinning information . . . . . . . . . . . . . . . . . . . . . . 3 7.1 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 7.2 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 5 8 Functional description . . . . . . . . . . . . . . . . . . . 5 9 Limiting values Recommended operating conditions Static characteristics Dynamic characteristics . . . . . . . . . . . . . . . . . . 8 13 Waveforms ...