MAX9972ACCS+DW Maxim Integrated, MAX9972ACCS+DW Datasheet - Page 20

• Manufacturer Part Number: MAX9972ACCS+DW
• Description: Buffers & Line Drivers
• Manufacturer: Maxim Integrated

Specifications of MAX9972ACCS+DW

• Rohs: yes

With adequate airflow, no external heat sinking is need-
ed under most operating conditions. If excess heat must
be dissipated through the exposed pad, solder it to cir-
cuit board copper. The exposed pad must be either left
unconnected, isolated, or connected to ground.
To minimize power consumption, activate only the
needed channels. Each channel placed in low-leakage
mode saves approximately 240mW.
Quad, Ultra-Low-Power, 300Mbps ATE
Drivers/Comparators
Figure 5. Serial-Interface Timing
20
______________________________________________________________________________________
DOUT
LOAD
SCLK
DIN
CS
t
CSSO
Power Minimization
t
D0 LAST
CSHO
D0
Heat Removal
t
DS
D1 LAST
D1
t
DH
D2 LAST
D2
t
CH
t
CL
D3 LAST
D3
PROCESS: BiCMOS
For the latest package outline information and land patterns
(footprints), go to www.maxim-ic.com/packages. Note that a
“+”, “#”, or “-” in the package code indicates RoHS status only.
Package drawings may show a different suffix character, but
the drawing pertains to the package regardless of RoHS status.
D4 LAST
80 TQFP-EP
PACKAGE
D4
TYPE
t
DO
D5 LAST
D5
PACKAGE
C80E+4
CODE
D10 LAST
D10
Package Information
Chip Information
D11 LAST
D11
OUTLINE
21-0115
t
NO.
CSH1
t
CSWH
PATTERN NO.
t
LDW
D0
90-0152
t
CSS1
LAND
t
CSHLD