MT48H32M16LFBF-75:B TR Micron Technology Inc, MT48H32M16LFBF-75:B TR Datasheet - Page 85

IC SDRAM 512MBIT 133MHZ 54VBGA

MT48H32M16LFBF-75:B TR

Manufacturer Part Number
MT48H32M16LFBF-75:B TR
Description
IC SDRAM 512MBIT 133MHZ 54VBGA
Manufacturer
Micron Technology Inc
Type
SDRAMr
Datasheet

Specifications of MT48H32M16LFBF-75:B TR

Format - Memory
RAM
Memory Type
Mobile SDRAM
Memory Size
512M (32Mx16)
Speed
133MHz
Interface
Parallel
Voltage - Supply
1.7 V ~ 1.95 V
Operating Temperature
0°C ~ 70°C
Package / Case
54-VFBGA
Organization
32Mx16
Density
512Mb
Address Bus
15b
Access Time (max)
8/5.4ns
Maximum Clock Rate
133MHz
Operating Supply Voltage (typ)
1.8V
Package Type
VFBGA
Operating Temp Range
0C to 70C
Operating Supply Voltage (max)
1.95V
Operating Supply Voltage (min)
1.7V
Supply Current
90mA
Pin Count
54
Mounting
Surface Mount
Operating Temperature Classification
Commercial
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
557-1390-2
Revision History
Rev. H, Production – 12/09
Rev. G, Production – 8/09
Rev. F, Production – 4/09
Rev. E, Production – 3/09
Rev. D, Production – 2/09
Rev. C, Production – 12/08
Rev. B, Preliminary – 4/08
Rev. A, Advance – 10/07
PDF: 09005aef82ea3742
512mb_mobile_sdram_y47m.pdf – Rev. H 12/09 EN
• Changed
• Updated format.
• AC Functional Characteristics table: Updated note 9.
• Typical I
• VFBGA Ball Descriptions table: Deleted ballout columns.
• I
• AC Functional Characteristics table: Corrected typographical error in heading.
• Options section: Added low-power option.
• 512Mb Mobile LPSDR Part Numbering figure: Added low-power option.
• I
• I
• I
• I
• Electrical Characteristics and Recommended AC Operating Conditions table: Upda-
• Target Output Drive Characteristics (Full Strength), Target Output Drive Characteris-
• Initial release.
tables: Updated values.
low-power option.
auto refresh current to
refresh current to
ted values for
tics (Three-Quarter Strength), and Target Output Drive Characteristics (One-Half
Strength) tables: Added drive-strength tables.
DD
DD7
DD
DD
DD7
Specifications and Conditions (x16) and I
Specifications and Conditions (x16) table: Updated I
Specifications and Conditions (x32): Updated I
Specifications and Conditions (x16 and x32) table: Added column with values for
Curves figure: Added figure.
DD7
t
RFC from 97.5ns to 72ns in Table 10 (page 20).
Curves figure: Changed current units on y-axis from mA to µA.
t
CH,
t
512Mb: 32 Meg x 16, 16 Meg x 32 Mobile SDRAM
RFC = 110ns.
t
CL.
t
RFC = 110ns.
85
Micron Technology, Inc. reserves the right to change products or specifications without notice.
DD
Specifications and Conditions (x32)
DD
values and changed I
DD
values and changed I
© 2007 Micron Technology, Inc. All rights reserved.
Revision History
DD5
auto
DD5

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