IS61LV25616AL-12TI ISSI, IS61LV25616AL-12TI Datasheet

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IS61LV25616AL-12TI

Manufacturer Part Number
IS61LV25616AL-12TI
Description
SRAM 4Mb 256Kx16 12ns 3.3v
Manufacturer
ISSI
Type
Asynchronousr
Datasheet

Specifications of IS61LV25616AL-12TI

Product Category
SRAM
Memory Size
4 Mbit
Organization
256 K x 16
Access Time
12 ns
Supply Voltage - Max
3.6 V
Supply Voltage - Min
3.135 V
Maximum Operating Current
100 mA
Maximum Operating Temperature
+ 85 C
Minimum Operating Temperature
- 40 C
Mounting Style
SMD/SMT
Package / Case
TSOP-44
Interface
TTL
Factory Pack Quantity
135
Integrated Silicon Solution, Inc. — www.issi.com —
Rev. F
12/15/2011
IS61LV25616AL
Copyright © 2011 Integrated Silicon Solution, Inc. All rights reserved. ISSI reserves the right to make changes to this specification and its products at any time without
notice. ISSI assumes no liability arising out of the application or use of any information, products or services described herein. Customers are advised to obtain the lat-
est version of this device specification before relying on any published information and before placing orders for products.
Integrated Silicon Solution, Inc. does not recommend the use of any of its products in life support applications where the failure or malfunction of the product can reason-
ably be expected to cause failure of the life support system or to significantly affect its safety or effectiveness. Products are not authorized for use in such applications
unless Integrated Silicon Solution, Inc. receives written assurance to its satisfaction, that:
a.) the risk of injury or damage has been minimized;
b.) the user assume all such risks; and
c.) potential liability of Integrated Silicon Solution, Inc is adequately protected under the circumstances
FUNCTIONAL BLOCK DIAGRAM
256K x 16 HIGH SPEED ASYNCHRONOUS
CMOS STATIC RAM WITH 3.3V SUPPLY
FEATURES
• High-speed access time:
• CMOS low power operation
• Low stand-by power:
• TTL compatible interface levels
• Single 3.3V power supply
• Fully static operation: no clock or refresh
• Three state outputs
• Data control for upper and lower bytes
• Industrial temperature available
• Lead-free available
— 10, 12 ns
— Less than 5 m
required
A
(typ.) CMOS stand-by
Lower Byte
Upper Byte
I/O8-I/O15
I/O0-I/O7
A0-A17
VDD
GND
OE
WE
CE
UB
LB
DECODER
CIRCUIT
CONTROL
CIRCUIT
DATA
I/O
1-800-379-4774
DESCRIPTION
The
static RAM organized as 262,144 words by 16 bits. It is
ogy. This highly reliable process coupled with innovative
power consumption devices.
When CE is HIGH (deselected), the device assumes a
memory. A data byte allows Upper Byte (UB) and Lower
Byte (LB) access.
The IS61LV25616AL is packaged in the JEDEC standard
44-pin 400-mil SOJ, 44-pin TSOP Type II, 44-pin LQFP
and 48-pin Mini BGA (8mm x 10mm).
fabricated using
circuit design techniques, yields high-performance and low
standby mode at which the power dissipation can be re-
duced down with CMOS input levels.
Easy memory expansion is provided by using Chip Enable
and Output Enable inputs, CE and OE. The active LOW
Write Enable (WE) controls both writing and reading of the
ISSI
MEMORY ARRAY
IS61LV25616AL is a high-speed, 4,194,304-bit
COLUMN I/O
256K x 16
ISSI
's high-performance CMOS technol-
DECEMBER 2011
1

Related parts for IS61LV25616AL-12TI

IS61LV25616AL-12TI Summary of contents

Page 1

... Write Enable (WE) controls both writing and reading of the memory. A data byte allows Upper Byte (UB) and Lower Byte (LB) access. The IS61LV25616AL is packaged in the JEDEC standard 44-pin 400-mil SOJ, 44-pin TSOP Type II, 44-pin LQFP and 48-pin Mini BGA (8mm x 10mm). A0-A17 DECODER VDD GND I/O DATA CIRCUIT CE OE CONTROL WE CIRCUIT UB LB 1-800-379-4774 DECEMBER 2011 IS61LV25616AL is a high-speed, 4,194,304-bit ISSI 's high-performance CMOS technol- 256K x 16 MEMORY ARRAY COLUMN I/O 1 ...

Page 2

... IS61LV25616AL TRUTH TABLE Mode WE CE Not Selected X Output Disabled H X Read Write PIN CONFIGURATIONS 44-Pin TSOP (Type II) and SOJ I/O0 7 I/O1 8 I/O2 9 I/O3 10 VDD 11 GND 12 I/O4 13 I/O5 14 I/ ...

Page 3

... IS61LV25616AL PIN CONFIGURATIONS 44-Pin LQFP I/O0 3 I/O1 4 I/O2 5 I/O3 TOP VIEW 6 VDD 7 GND 8 I/O4 9 I/O5 10 I/ PIN DESCRIPTIONS A0-A17 Address Inputs I/O0-I/O15 Data Inputs/Outputs CE Chip Enable Input OE Output Enable Input Write Enable Input WE Lower-byte Control (I/O0-I/O7 Upper-byte Control (I/O8-I/O15 Connection V Power DD GND Ground Integrated Silicon Solution, Inc. — ...

Page 4

... IS61LV25616AL ABSOLUTE MAXIMUM RATINGS Symbol Parameter V Terminal Voltage with Respect to GND term t Storage Temperature stg P Power Dissipation t Note: 1. Stress greater than those listed under ABSOLUTE MAXIMUM RATINGS may cause permanent damage to the device. This is a stress rating only and functional operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect reliability. OPERATING RANGE Range Ambient Temperature Commercial 0°C to +70°C Industrial – ...

Page 5

... IS61LV25616AL POWER SUPPLY CHARACTERISTICS Symbol Parameter Test Conditions I V Dynamic Operating Supply Current I out I TTL Standby Current (TTL Inputs ≥ TTL Standby Current (TTL Inputs ≥ CMOS Standby Current (CMOS Inputs) CE ≥ V In Note address and data inputs are cycling at the maximum frequency means no input lines change. ...

Page 6

... IS61LV25616AL READ CYCLE SWITCHING CHARACTERISTICS Symbol Parameter t Read Cycle Time rc t Address Access Time aa t Output Hold Time oHa t CE Access Time ace t OE Access Time Doe High-Z Output (2) Hzoe t ( Low-Z Output Lzoe High-Z Output Hzce Low-Z Output (2) Lzce t LB, UB Access Time ba t (2) LB High-Z Output Hzb t LB Low-Z Output (2) Lzb t Power Up Time Pu t Power Down Time ...

Page 7

... IS61LV25616AL AC WAVEFORMS READ CYCLE NO. 1 (1,2) (Address Controlled) ( ADDRESS D OUT PREVIOUS DATA VALID READ CYCLE NO. 2 (1,3) ADDRESS LZCE LB HIGH-Z D OUT V DD Supply Current Notes HIGH for a Read Cycle. 2. The device is continuously selected. OE, CE, UB Address is valid prior to or coincident with CE LOW transition. Integrated Silicon Solution, Inc. — www.issi.com — ...

Page 8

... IS61LV25616AL READ CYCLE NO. 2 (1,3) ADDRESS LZCE LB LZB HIGH-Z D OUT V DD Supply Current Notes HIGH for a Read Cycle. 2. The device is continuously selected. OE, CE, UB Address is valid prior to or coincident with CE LOW transition. WRITE CYCLE SWITCHING CHARACTERISTICS Symbol Parameter t Write Cycle Time Write End sce t Address Setup Time to Write End aw t Address Hold from Write End ...

Page 9

... IS61LV25616AL AC WAVEFORMS WRITE CYCLE NO. 1 (CE Controlled HIGH or LOW) ADDRESS UB DATA UNDEFINED OUT D IN Notes: 1. WRITE is an internally generated signal asserted during an overlap of the LOW states on the CE and WE inputs and at least one of the LB and UB inputs being in the LOW state WRITE = (CE) (LB) = (UB) (WE). WRITE CYCLE NO. 2 (WE Controlled HIGH During Write Cycle) ADDRESS OE CE LOW ...

Page 10

... IS61LV25616AL AC WAVEFORMS WRITE CYCLE NO. 3 (WE Controlled LOW During Write Cycle) ADDRESS OE LOW CE LOW UB DATA UNDEFINED OUT D IN WRITE CYCLE NO. 4 (LB, UB Controlled, Back-to-Back Write) ADDRESS OE CE LOW WE UB HZWE D OUT DATA UNDEFINED D IN Notes: 1. The internal Write time is defined by the overlap Low, UB and/ Low, and WE = LOW. All signals must be in valid states to initiate a Write, but any can be deasserted to terminate the Write ...

Page 11

... IS61LV25616AL DATA RETENTION SWITCHING CHARACTERISTICS Symbol Parameter V V for Data Retention Data Retention Current Dr t Data Retention Setup Time See Data Retention Waveform sDr t Recovery Time rDr Note 1: Typical values are measured 3.0V DATA RETENTION WAVEFORM V DD 1.65V 1. GND Integrated Silicon Solution, Inc. — www.issi.com — Rev. F 12/15/2011 (LL) Test Condition Options See Data Retention Waveform V = 2.0V, CE ≥ ...

Page 12

... Speed (ns) Order Part No. 10 IS61LV25616AL-10TI IS61LV25616AL-10TLI IS61LV25616AL-10KI IS61LV25616AL-10KLI IS61LV25616AL-10LQI IS61LV25616AL-10LQLI IS61LV25616AL-10BI IS61LV25616AL-10BLI 12 IS61LV25616AL-12TI 12 Package TSOP (Type II) TSOP (Type II), Lead-free 400-mil SOJ TSOP (Type II) Package TSOP (Type II) TSOP (Type II), Lead-free 400-mil SOJ 400-mil SOJ, Lead-free LQFP LQFP, Lead-free Mini BGA (8mm x 10mm) Mini BGA (8mm x 10mm), Lead-free TSOP (Type II) Integrated Silicon Solution, Inc. — ...

Page 13

... IS61LV25616AL Integrated Silicon Solution, Inc. — www.issi.com — Rev. F 12/15/2011 1-800-379-4774 13 ...

Page 14

... IS61LV25616AL 14 Integrated Silicon Solution, Inc. — www.issi.com — 1-800-379-4774 Rev. F 12/15/2011 ...

Page 15

... IS61LV25616AL Integrated Silicon Solution, Inc. — www.issi.com — Rev. F 12/15/2011 1-800-379-4774 15 ...

Page 16

... IS61LV25616AL 16 Integrated Silicon Solution, Inc. — www.issi.com — 1-800-379-4774 Rev. F 12/15/2011 ...

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