C8051F703-GQR Silicon Labs, C8051F703-GQR Datasheet - Page 42
![no-image](/images/no-image-200.jpg)
C8051F703-GQR
Manufacturer Part Number
C8051F703-GQR
Description
8-bit Microcontrollers - MCU 16kB Cap Sense
Manufacturer
Silicon Labs
Datasheet
1.C8051F709-GQR.pdf
(306 pages)
Specifications of C8051F703-GQR
Rohs
yes
Core
8051
Data Bus Width
8 bit
Processor Series
C8051
Available stocks
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Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
C8051F703-GQR
Manufacturer:
Silicon Laboratories Inc
Quantity:
10 000
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C8051F70x/71x
42
Notes:
General
Solder Mask Design
Stencil Design
Card Assembly
1. All dimensions shown are in millimeters (mm) unless otherwise noted.
2. Dimensioning and Tolerancing is per the ANSI Y14.5M-1994 specification.
3. This Land Pattern Design is based on IPC-SM-7351 guidelines.
4. All dimensions shown are at Maximum Material Condition (MMC). Least Material Condition (LMC) is calculated
5. All metal pads are to be non-solder mask defined (NSMD). Clearance between the solder mask and the metal pad is
6. A stainless steel, laser-cut and electro-polished stencil with trapezoidal walls should be used to assure good solder
7. The stencil thickness should be 0.125 mm (5 mils).
8. The ratio of stencil aperture to land pad size should be 1:1 for all perimeter pads.
9. A 3x3 array of 1.20 mm square openings on 1.40 mm pitch should be used for the center ground pad.
10. A No-Clean, Type-3 solder paste is recommended.
11. The recommended card reflow profile is per the JEDEC/IPC J-STD-020 specification for Small Body Components.
based on a Fabrication Allowance of 0.05 mm.
to be 60 µm minimum, all the way around the pad.
paste release.
Dimension
C1
C2
X1
X2
Y1
Y2
e
Table 6.2. QFN-48 PCB Land Pattern Dimensions
Figure 6.2. QFN-48 PCB Land Pattern
Rev. 1.0
6.80
6.80
0.20
4.00
0.75
4.00
Min
0.50 BSC
Max
6.90
6.90
0.30
4.10
0.85
4.10
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