W25Q80BVSSIG Winbond Electronics, W25Q80BVSSIG Datasheet - Page 69
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W25Q80BVSSIG
Manufacturer Part Number
W25Q80BVSSIG
Description
IC FLASH 8MBIT 8SOIC
Manufacturer
Winbond Electronics
Datasheet
1.W25Q80BVSSIG.pdf
(75 pages)
Specifications of W25Q80BVSSIG
Format - Memory
FLASH
Memory Type
FLASH
Memory Size
8M (1M x 8)
Speed
104MHz
Interface
SPI Serial
Voltage - Supply
2.7 V ~ 3.6 V
Operating Temperature
-40°C ~ 85°C
Package / Case
8-SOIC (5.3mm Width), 8-SOP, 8-SOEIAJ
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
Q4816329
T1015683
T1015683
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
W25Q80BVSSIG
Manufacturer:
Winbond
Quantity:
2 100
Company:
Part Number:
W25Q80BVSSIG
Manufacturer:
WINBOND
Quantity:
192
Part Number:
W25Q80BVSSIG
Manufacturer:
WINBOND/华邦
Quantity:
20 000
11.2 8-Pin SOIC 208-mil (Package Code SS)
Notes:
1. Controlling dimensions: millimeters, unless otherwise specified.
2. BSC = Basic lead spacing between centers.
3. Dimensions D1 and E1 do not include mold flash protrusions and should be measured from the bottom of the package.
4. Formed leads coplanarity with respect to seating plane shall be within 0.004 inches.
SYMBOL
A1
A2
D1
E1
e
A
C
D
E
H
b
L
θ
y
(2)
Min
1.75
0.05
1.70
0.35
0.19
5.18
5.13
5.18
5.13
7.70
0.50
---
0°
MILLIMETERS
1.27 BSC.
Nom
1.95
0.15
1.80
0.42
0.20
5.28
5.23
5.28
5.23
7.90
0.65
---
---
Max
2.16
0.25
1.91
0.48
0.25
5.38
5.33
5.38
5.33
8.10
0.80
0.10
- 69 -
8°
0.069
0.002
0.067
0.014
0.007
0.204
0.202
0.204
0.202
0.303
0.020
Min
---
0°
Publication Release Date: October 06, 2010
0.050 BSC.
INCHES
Nom
0.077
0.006
0.071
0.017
0.008
0.208
0.206
0.208
0.206
0.311
0.026
---
---
Max
0.085
0.010
0.075
0.019
0.010
0.212
0.210
0.212
0.210
0.319
0.031
0.004
8°
W25Q80BV
GAUGE PLANE
GAUGE PLANE
Revision D